H10P 74/277
Circuits for electrically characterising or monitoring manufacturing processes
Official title: {Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers}
H10P74/277 (Circuits for electrically characterising or monitoring manufacturing processes) appears on 3,177 US grants and 3,166 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,177
- Published applications
- 3,166
- Assignees
- 652
- Inventors
- 6,179
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 10 | 0 |
| 1994 | 9 | 0 |
| 1995 | 15 | 0 |
| 1996 | 13 | 0 |
| 1997 | 36 | 0 |
| 1998 | 35 | 0 |
| 1999 | 67 | 0 |
| 2000 | 75 | 0 |
| 2001 | 74 | 33 |
| 2002 | 90 | 79 |
| 2003 | 125 | 100 |
| 2004 | 126 | 119 |
| 2005 | 120 | 138 |
| 2006 | 117 | 115 |
| 2007 | 85 | 80 |
| 2008 | 67 | 113 |
| 2009 | 59 | 113 |
| 2010 | 111 | 84 |
| 2011 | 78 | 93 |
| 2012 | 81 | 82 |
| 2013 | 88 | 120 |
| 2014 | 96 | 143 |
| 2015 | 132 | 138 |
| 2016 | 135 | 113 |
| 2017 | 182 | 133 |
| 2018 | 139 | 134 |
| 2019 | 138 | 153 |
| 2020 | 155 | 151 |
| 2021 | 143 | 138 |
| 2022 | 113 | 159 |
| 2023 | 132 | 175 |
| 2024 | 134 | 132 |
| 2025 | 88 | 132 |
| 2026 | 68 | 196 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Carrier-resolved hall measurement with multi-harmonic magnetoresistance analysis22 Sep 2026US 12,742,812 B2International Business Machines Corporation
- Apparatus and test element group15 Sep 2026US 12,740,142 B2Micron Technology, Inc.
- Test key structure15 Sep 2026US 12,740,382 B2United Semiconductor (Xiamen) Co., Ltd.
- Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium8 Sep 2026US 12,733,455 B2Yamaha Robotics Co., Ltd.
- Substrate including test circuit and substrate test apparatus including the substrate8 Sep 2026US 12,733,460 B2Samsung Electronics Co., Ltd.
- Surface inspection tool for transfer tools and methods of using the same8 Oct 2026US 2026/0309645 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Voltage contrast for backside processes on wafers1 Oct 2026US 2026/0299019 A1Intel Corporation
- Probing pad design in scribe line for flip chip package24 Sep 2026US 2026/0293616 A1Nanya Technology Corporation
- Test circuit and method for operating the same17 Sep 2026US 2026/0276697 A1Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for adaptive semiconductor process control17 Sep 2026US 2026/0282849 A1Qomplx LLC
Most cited
By later US patents
- Vertical system integration289US 7,402,897 B2Elm Technology Corporation · 2008
- System and method for product yield prediction using device and process neighborhood characterization vehicle235US 6,795,952 B1PDF Solutions, Inc. · 2004
- Overlay alignment metrology using diffraction gratings230US 6,819,426 B2Therma-Wave, Inc. · 2004
- Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices229US 6,771,806 B1KLA-Tencor Corporation · 2004
- System and method for product yield prediction using a logic characterization vehicle223US 6,834,375 B1PDF Solutions, Inc. · 2004