Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium

An inspection method for inspecting a plurality of substrates arranged along a first direction and a second direction, wherein the plurality of substrates comprises a central substrate located at center and treated as a mounting section of a semiconductor chip and peripheral substrates located around the central substrate and treated as a plurality of peripheral sections, the inspection method comprises steps of:

• measuring a reference position of the mounting section before mounting of the semiconductor chip;
• measuring a reference position of the plurality of peripheral sections located around the mounting section;
• measuring a position of the semiconductor chip after mounting;
• and,
• based on a distance between the reference position of the mounting section and the reference position of the plurality of peripheral sections and a distance between the reference position of the plurality of peripheral sections and a mounting position of the semiconductor chip after mounting of the semiconductor chip, inspecting a relative position of the semiconductor chip with respect to the mounting section.

A non-transitory computer readable recording medium storing a program for inspecting a plurality of substrates arranged along a first direction and a second direction, wherein the plurality of substrates comprises a central substrate located at center and treated as a mounting section of a semiconductor chip and peripheral substrates located around the central substrate and treated as a plurality of peripheral sections, the program causing a computer to execute:

• processing for measuring a reference position of the mounting section before mounting of the semiconductor chip;
• processing for measuring a reference position of the plurality of peripheral sections located around the mounting section;
• processing for measuring a position of the semiconductor chip after mounting;
• and
• processing for, based on a distance between the reference position of the mounting section and the reference position of the plurality of peripheral sections and a distance between the reference position of the plurality of peripheral sections and a mounting position of the semiconductor chip after mounting of the semiconductor chip, inspecting a relative position of the semiconductor chip with respect to the mounting section.