Probing pad design in scribe line for flip chip package

Abstract

A scribe line structure is provided. The scribe line structure includes a die region, a scribe line region, one or more bump pads, one or more circuit probing pads, and one or more metal wires. The die region is disposed on a semiconductor wafer. The scribe line region surrounds the die region. The one or more bump pads are disposed on a first top surface of an edge region of the die region. The one or more circuit probing pads are disposed on a second top surface of the scribe line region. The one or more metal wires are disposed on the first top surface of the die region and the second top surface of the scribe line region, and configured to electrically connect the one or more bump pads to the one or more circuit probing pads.

Dependencies are inferred from the claim text.