H10P 52/00
Grinding, lapping or polishing of wafers, substrates or parts of devices
H10P52/00 (Grinding, lapping or polishing of wafers, substrates or parts of devices) appears on 7,674 US grants and 9,339 published applications in this corpus.
Search patents in H10P- Granted patents
- 7,674
- Published applications
- 9,339
- Assignees
- 1,376
- Inventors
- 13,253
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 10 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 12 | 0 |
| 1982 | 7 | 0 |
| 1983 | 7 | 0 |
| 1984 | 10 | 0 |
| 1985 | 4 | 0 |
| 1986 | 7 | 0 |
| 1987 | 8 | 0 |
| 1988 | 15 | 0 |
| 1989 | 14 | 0 |
| 1990 | 18 | 0 |
| 1991 | 21 | 0 |
| 1992 | 23 | 0 |
| 1993 | 22 | 0 |
| 1994 | 23 | 0 |
| 1995 | 24 | 0 |
| 1996 | 17 | 0 |
| 1997 | 25 | 0 |
| 1998 | 41 | 0 |
| 1999 | 86 | 0 |
| 2000 | 153 | 0 |
| 2001 | 202 | 85 |
| 2002 | 239 | 264 |
| 2003 | 228 | 315 |
| 2004 | 219 | 323 |
| 2005 | 209 | 321 |
| 2006 | 203 | 256 |
| 2007 | 172 | 221 |
| 2008 | 143 | 207 |
| 2009 | 108 | 177 |
| 2010 | 104 | 161 |
| 2011 | 117 | 143 |
| 2012 | 102 | 152 |
| 2013 | 152 | 206 |
| 2014 | 200 | 274 |
| 2015 | 267 | 523 |
| 2016 | 419 | 440 |
| 2017 | 446 | 516 |
| 2018 | 382 | 514 |
| 2019 | 451 | 579 |
| 2020 | 507 | 636 |
| 2021 | 433 | 566 |
| 2022 | 372 | 503 |
| 2023 | 363 | 466 |
| 2024 | 380 | 601 |
| 2025 | 412 | 526 |
| 2026 | 278 | 364 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same6 Oct 2026US 12,752,390 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer processing method6 Oct 2026US 12,757,662 B2Disco Corporation
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- Methods of forming an abrasive slurry and methods for chemical-mechanical polishing29 Sep 2026US 12,746,637 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Physical vapor deposition system and methods of operating the same29 Sep 2026US 12,747,492 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor processing tool and methods of operation8 Oct 2026US 2026/0307200 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Cmp slurry composition for polishing copper barrier layer8 Oct 2026US 2026/0308417 A1Ycchem Co., Ltd.
- Finfet device having flat-top epitaxial features and method of making the same8 Oct 2026US 2026/0314059 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Source/drain contacts connecting 2-d material layer and method for forming the same8 Oct 2026US 2026/0314276 A1National Yang Ming.Chiao Tung University
- Semiconductor device structure and manufacturing method thereof8 Oct 2026US 2026/0314277 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Semiconductor device and manufacturing method thereof4,349US 7,674,650 B2Semiconductor Energy Laboratory Co.Ltd. · 2010
- Semiconductor device and manufacturing method thereof4,064US 7,732,819 B2Semiconductor Energy Laboratory Co.Ltd. · 2010
- Apparatus and method for forming semiconductor contacts1,331US 8,772,109 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Semiconductor device and manufacturing method thereof849US 7,910,490 B2Semiconductor Energy Laboratory Co.Ltd. · 2011
- Semiconductor device and manufacturing method thereof834US 7,932,521 B2Semiconductor Energy Laboratory Co.Ltd. · 2011