H10P 52/20
Electromechanical polishing [emp]
Official title: Electromechanical polishing [EMP]; Electrochemical mechanical polishing [ECMP]
H10P52/20 (Electromechanical polishing [emp]) appears on 144 US grants and 223 published applications in this corpus.
Search patents in H10P- Granted patents
- 144
- Published applications
- 223
- Assignees
- 60
- Inventors
- 339
- Latest grant
- 10 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 2 | 2 |
| 2002 | 3 | 7 |
| 2003 | 3 | 12 |
| 2004 | 12 | 33 |
| 2005 | 12 | 27 |
| 2006 | 18 | 32 |
| 2007 | 20 | 27 |
| 2008 | 14 | 14 |
| 2009 | 11 | 13 |
| 2010 | 6 | 7 |
| 2011 | 2 | 2 |
| 2012 | 4 | 4 |
| 2013 | 2 | 3 |
| 2014 | 5 | 7 |
| 2015 | 6 | 5 |
| 2016 | 6 | 3 |
| 2017 | 3 | 4 |
| 2018 | 2 | 5 |
| 2019 | 3 | 2 |
| 2020 | 2 | 0 |
| 2021 | 2 | 5 |
| 2022 | 1 | 0 |
| 2023 | 1 | 2 |
| 2024 | 3 | 1 |
| 2025 | 1 | 3 |
| 2026 | 0 | 3 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Photoelectric fluid field cluster catalytic method for atomic-scale deterministic processing10 Jun 2025US 12,325,017 B2Zhejiang University
- Face-up wafer electrochemical planarization apparatus17 Sep 2024US 12,090,600 B2APPLIED Materials.Inc.
- Electrochemical mechanical polishing and planarization equipment for processing conductive wafer substrate25 Jun 2024US 12,017,293 B2Hangzhou Sizone Electronic Technology Inc.
- Methods and apparatus for forming dual metal interconnects2 Apr 2024US 11,948,885 B2APPLIED Materials.Inc.
- Thickness sensor for conductive features18 Apr 2023US 11,631,618 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing method and substrate processing apparatus17 Sep 2026US 2026/0282843 A1Tokyo Electron Limited
- Semiconductor manufacturing tool19 Mar 2026US 2026/0082858 A1
- Method for processing a wafer8 Jan 2026US 2026/0011566 A1Nanya Technology Corporation
- Electrochemical polishing method employing solid electro-conductive media with bi-directional planetary motion25 Dec 2025US 2025/0387863 A1Beijing Institute of Technology
- Photoelectric fluid field cluster catalytic method for atomic-scale deterministic processing8 May 2025US 2025/0144609 A1Zhejiang University
Most cited
By later US patents
- Electrochemical mechanical planarization apparatus and method211US 6,368,190 B1Agere Systems Guardian Corp. · 2002
- Electrochemical-control of abrasive polishing and machining rates101US 6,171,467 B2The John Hopkins University · 2001
- Method and apparatus for electrochemical-mechanical planarization97US 6,379,223 B1APPLIED Materials.Inc. · 2002
- Controlled electrochemical polishing method77US 7,998,335 B2Cabot Microelectronics Corporation · 2011
- Method for electrochemically processing a workpiece66US 6,867,136 B2Nutool, Inc. · 2005