US 6,379,223 B1 · Method and apparatus for electrochemical-mechanical planarization

Abstract

A method for performing electrochemical-mechanical planarization (EMP) of a workpiece surface including a pattern of electrical conductors comprises supplying a chemical-mechanical polishing (CMP)-type apparatus having an abrasive or non-abrasive polishing pad with an oxidizer-free, electrolytically conductive, abrasive or non-abrasive fluid and applying a time-varying anodic potential to the workpiece surface for controllably dissolving the material, e.g., metal, of the electrical conductors while simultaneously applying mechanical polishing action to the surface. The method advantageously reduces or substantially eliminates undesirable dishing characteristic of conventional CMP planarization processing utilizing chemical oxidizer agent(s). Apparatus for performing EMP are also disclosed.

Claims5

Dependent claims

A method of planarizing a surface of a workpiece by electrochemical-mechanical planarization (EMP), comprising:

(a) providing a chemical-mechanical polishing (CMP) apparatus with at least one workpiece having at least one surface to be planarized by EMP;
(b) supplying said CMP apparatus with an electrolytically conductive fluid free of chemical oxidizing agent(s);
and
(c) planarizing the at least one workpiece surface by EMP utilizing said CMP apparatus, said planarizing by EMP including applying a time-varying electrochemical potential to the at least one workpiece surface;
wherein step (c) comprises performing said EMP by controllably applying a time varying anodic potential to said at least one workpiece surface, wherein the time varying anodic potential comprises applying a first, higher anodic potential to said workpiece surface during an initial stage of said EMP and applying a second, lower anodic potential to said workpiece surface during a later stage of said EMP.

2 more elements

Dependencies are inferred from the claim text.

Method and apparatus for electrochemical-mechanical planarization

Life of this patent

Method and apparatus for electrochemical-mechanical planarization

Life of this patent

Abstract

Claims5