Electrochemical mechanical planarization apparatus and method

Abstract

An apparatus for the electrochemical mechanical planarization of semiconductor wafers includes a rotatable platen and a polishing pad disposed on the platen. The polishing pad has top and bottom surfaces. A wafer carrier is disposed proximate to the platen for pressing a semiconductor wafer against the platen. At least one carrier electrode is disposed on the carrier and is adapted to electrically connect an electrically conducting surface of the semiconductor wafer to an electrolytic circuit including a potential source. A platen electrode is operatively connected to the platen. The platen electrode electrically connects an electrolytic solution disposed on the polishing pad to the potential source and to the electrode on the wafer carrier to complete the electrolytic circuit. The platen electrode has a substantially circular circumference for discharging electrons into the electrolytic solution. The platen electrode is substantially devoid of portions under the bottom surface of the polishing pad.

Dependencies are inferred from the claim text.