H10P 52/40
Chemomechanical polishing [cmp]
Official title: Chemomechanical polishing [CMP] (electrochemical mechanical polishing H10P52/20)
H10P52/40 (Chemomechanical polishing [cmp]) appears on 4,760 US grants and 5,555 published applications in this corpus.
Search patents in H10P- Granted patents
- 4,760
- Published applications
- 5,555
- Assignees
- 839
- Inventors
- 7,948
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 6 | 0 |
| 1991 | 7 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 12 | 0 |
| 1998 | 23 | 0 |
| 1999 | 60 | 0 |
| 2000 | 117 | 0 |
| 2001 | 161 | 75 |
| 2002 | 200 | 221 |
| 2003 | 198 | 260 |
| 2004 | 182 | 251 |
| 2005 | 154 | 229 |
| 2006 | 155 | 184 |
| 2007 | 134 | 174 |
| 2008 | 106 | 154 |
| 2009 | 80 | 134 |
| 2010 | 72 | 121 |
| 2011 | 88 | 90 |
| 2012 | 73 | 106 |
| 2013 | 101 | 119 |
| 2014 | 126 | 158 |
| 2015 | 145 | 311 |
| 2016 | 242 | 272 |
| 2017 | 267 | 274 |
| 2018 | 230 | 272 |
| 2019 | 263 | 341 |
| 2020 | 309 | 398 |
| 2021 | 248 | 319 |
| 2022 | 204 | 269 |
| 2023 | 214 | 219 |
| 2024 | 211 | 232 |
| 2025 | 194 | 210 |
| 2026 | 123 | 162 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same6 Oct 2026US 12,752,390 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- Methods of forming an abrasive slurry and methods for chemical-mechanical polishing29 Sep 2026US 12,746,637 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Physical vapor deposition system and methods of operating the same29 Sep 2026US 12,747,492 B2Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for controlling chemical mechanical planarization29 Sep 2026US 12,751,254 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor processing tool and methods of operation8 Oct 2026US 2026/0307200 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Cmp slurry composition for polishing copper barrier layer8 Oct 2026US 2026/0308417 A1Ycchem Co., Ltd.
- Finfet device having flat-top epitaxial features and method of making the same8 Oct 2026US 2026/0314059 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device structure and manufacturing method thereof8 Oct 2026US 2026/0314277 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chemical mechanical polishing system and controlling method thereof1 Oct 2026US 2026/0295764 A1Korea University Research and Business Foundation, Sejong Campus
Most cited
By later US patents
- Apparatus and method for forming semiconductor contacts1,331US 8,772,109 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Chemical mechanical polishing slurry for metal layers541US 5,527,423 ACabot Corporation · 1996
- Continuous processing system for chemical mechanical polishing501US 5,738,574 AAPPLIED Materials.Inc. · 1998
- Indirect endpoint detection by chemical reaction and chemiluminescence486US 6,126,848 AInternational Business Machines Corporation · 2000
- Low temperature system and method for CVD copper removal383US 5,897,379 ASharp Kabushiki Kaisha · 1999