H10P 52/407
Of inorganic insulating materials
Official title: {of inorganic insulating materials}
H10P52/407 (Of inorganic insulating materials) appears on 1 US grants and 44 published applications in this corpus.
Search patents in H10P- Granted patents
- 1
- Published applications
- 44
- Assignees
- 15
- Inventors
- 114
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2023 | 0 | 1 |
| 2024 | 0 | 6 |
| 2025 | 0 | 10 |
| 2026 | 1 | 27 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Cmp polishing liquid and polishing method1 Oct 2026US 2026/0297380 A1Resonac Corporation
- Polishing composition1 Oct 2026US 2026/0297382 A1
- Polishing slurry, polishing system, and method for polishing semiconductor substrate1 Oct 2026US 2026/0297384 A1
- Polishing composition1 Oct 2026US 2026/0297404 A1
- Chemical-mechanical polishing composition containing silica and ceria abrasives1 Oct 2026US 2026/0297406 A1Entegris, Inc.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.