Polishing composition

Abstract

A technical problem to be solved is to provide a novel polishing composition that ensures the polishing removal rate for a film having silicon-silicon bonds such as polysilicon at or above a certain level, increases the ratio of the polishing removal rate for the film having silicon-silicon bonds such as polysilicon to the polishing removal rate for an insulating film such as a film having oxygen-silicon bonds being a function as a stopper layer, and at the same time, can suppress the above-described micro-scratches. A polishing composition comprising: colloidal silica having the number of silanol groups of more than 2 groups/nm2 and less than 6 groups/nm2; a nitrogen-containing basic compound; and a liquid carrier, wherein, when a concentration of the colloidal silica is 1.5% by mass, a transmittance when transmitting light having a wavelength of 450 nm is more than 1.10% and less than 100%, and the polishing composition has a pH of 9.0 to 11.5.

Dependencies are inferred from the claim text.