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H10P 52/402

Of semiconductor materials

Official title: {of semiconductor materials}

H10P52/402 (Of semiconductor materials) appears on 1,797 US grants and 2,162 published applications in this corpus.

Search patents in H10P

Granted patents: 1,797
Published applications: 2,162
Assignees: 498
Inventors: 3,678
Latest grant: 6 Oct 2026

Filings by year

H10P 52/402: granted patents and published applications per publication year
Year	Granted patents	Published applications
1976	1	0
1977	3	0
1978	2	0
1979	1	0
1980	0	0
1981	3	0
1982	1	0
1983	1	0
1984	3	0
1985	0	0
1986	1	0
1987	1	0
1988	1	0
1989	1	0
1990	3	0
1991	3	0
1992	1	0
1993	1	0
1994	2	0
1995	1	0
1996	1	0
1997	2	0
1998	3	0
1999	17	0
2000	21	0
2001	43	13
2002	40	34
2003	33	36
2004	30	49
2005	27	32
2006	31	33
2007	30	31
2008	14	23
2009	22	24
2010	15	30
2011	22	27
2012	15	26
2013	35	67
2014	42	97
2015	81	177
2016	124	145
2017	139	158
2018	133	154
2019	140	162
2020	147	177
2021	113	136
2022	98	129
2023	102	103
2024	91	120
2025	90	100
2026	66	79

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

Recent patents

Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same6 Oct 2026US 12,752,390 B2Taiwan Semiconductor Manufacturing Company.Ltd
Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
Methods of forming an abrasive slurry and methods for chemical-mechanical polishing29 Sep 2026US 12,746,637 B2Taiwan Semiconductor Manufacturing Company.Ltd
System and method for controlling chemical mechanical planarization29 Sep 2026US 12,751,254 B2Taiwan Semiconductor Manufacturing Company.Ltd
Polishing composition for semiconductor process and method for polishing a substrate using the same22 Sep 2026US 12,742,096 B2Ycchem Co., Ltd.

Most cited

By later US patents