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US 2026/0295771 A1Published application
Polishing pad and method for polishing object to be polished
AssigneeKureha Corporation
InventorsKenta USHIRO, Takahiro KUDO
Life of this patent
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Abstract
A polishing pad of the present invention includes a polishing layer including a composition containing a hydrolyzable resin and an abrasive grain having a median diameter of less than 2 μm.
Claims10
A polishing pad, comprising a polishing layer comprising a composition containing a hydrolyzable resin and an abrasive grain having a median diameter of less than 2 μm.
Dependencies are inferred from the claim text.