H10P 58/00
Singulating wafers or substrates into multiple chips, i.e. dicing
H10P58/00 (Singulating wafers or substrates into multiple chips, i.e. dicing) appears on 178 US grants and 322 published applications in this corpus.
Search patents in H10P- Granted patents
- 178
- Published applications
- 322
- Assignees
- 124
- Inventors
- 704
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 3 |
| 2009 | 1 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 4 |
| 2012 | 1 | 3 |
| 2013 | 5 | 12 |
| 2014 | 7 | 12 |
| 2015 | 12 | 21 |
| 2016 | 21 | 16 |
| 2017 | 11 | 18 |
| 2018 | 19 | 13 |
| 2019 | 16 | 20 |
| 2020 | 17 | 15 |
| 2021 | 8 | 10 |
| 2022 | 12 | 17 |
| 2023 | 6 | 28 |
| 2024 | 10 | 24 |
| 2025 | 19 | 23 |
| 2026 | 12 | 80 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wafer processing method6 Oct 2026US 12,757,662 B2Disco Corporation
- Photonic integrated circuit chip facet preparation via laser-based dicing29 Sep 2026US 12,751,230 B2IonQ, Inc.
- Light-emitting diode package structure and manufacturing method thereof25 Aug 2026US 12,720,938 B2E Ink Holdings Inc.
- Optoelectronic semiconductor component, optoelectronic device, and method for producing an optoelectronic semiconductor component and/or optoelectronic device11 Aug 2026US 12,707,771 B2ams-OSRAM International GmbH
- Methods of separating semiconductor dies14 Jul 2026US 12,685,060 B2Texas Instruments Incorporated
- Base film agent and processing method for workpiece8 Oct 2026US 2026/0314287 A1Disco Corporation
- Methods of separating semiconductor dies8 Oct 2026US 2026/0314289 A1
- Substrate production method and chip production method8 Oct 2026US 2026/0314344 A1Disco Corporation
- Grinding wheel, method for grinding workpiece, and method for manufacturing chip1 Oct 2026US 2026/0295760 A1Disco Corporation
- Protective film agent, protective film forming method, and chip manufacturing method1 Oct 2026US 2026/0297341 A1Disco Corporation
Most cited
By later US patents
- Integrated circuit assemblies with reinforcement frames, and methods of manufacture50US 9,355,997 B2Invensas Corporation · 2016
- Active matrix ESD protection and testing scheme21US 6,613,650 B1Hyundai Electronics America · 2003
- Process for forming package-on-package structures15US 8,975,741 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Opening in a multilayer polymeric dielectric layer without delamination12US 9,502,365 B2Texas Instruments Incorporated · 2016
- Semiconductor device and method of forming embedded wafer level chip scale packages10US 9,704,824 B2STATS ChipPAC Pte. Ltd. · 2017