Light-emitting diode package structure and manufacturing method thereof
AssigneeE Ink Holdings Inc.
InventorSheng-Chieh Tai
Life of this patent
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Abstract
A light-emitting diode package structure includes a driving substrate, at least one light-emitting unit, and a reflective colloid. The driving substrate has a surface. The light-emitting unit includes at least one mini light-emitting diode and at least one wavelength conversion layer. The mini light-emitting diode is disposed on the surface of the driving substrate and electrically connected to the driving substrate. The wavelength conversion layer covers the mini light-emitting diode. The reflective colloid covers a periphery of the light-emitting unit and the driving substrate. The light-emitting unit is suitable for emitting a light, and the reflective colloid is suitable for reflecting the light so as to focus on a light-emitting direction.
Claims3
A manufacturing method of a light-emitting diode package structure, comprising:
- first, providing a driving substrate and at least one mini light-emitting diode;
- second, joining the at least one mini light-emitting diode on the driving substrate, wherein the driving substrate has a surface, and the at least one mini light-emitting diode is disposed on the surface of the driving substrate and is electrically connected to the driving substrate;
- third, forming a wavelength conversion layer to cover the at least one mini light-emitting diode;
- fourth, performing a singulation process to cut the wavelength conversion layer and the driving substrate to define a light-emitting unit positioned on the driving substrate;
- and
- fifth, forming a reflective colloid to cover a periphery of the light-emitting unit and the driving substrate, wherein the light-emitting unit is suitable for emitting a light, and the reflective colloid is suitable for reflecting the light so as to focus on a light-emitting direction.
Dependencies are inferred from the claim text.