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US 9,355,997 B2Granted
Integrated circuit assemblies with reinforcement frames, and methods of manufacture
AssigneeInvensas Corporation
InventorsRajesh Katkar, Laura Wills Mirkarimi, Arkalgud Sitaram, Charles G. Woychik
Life of this patent
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Abstract
An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.
Claims22
An assembly comprising:
- a first substrate comprising a plurality of first contact pads;
- a plurality of modules attached to the first substrate, at least one said module comprising a semiconductor integrated circuit, the module comprising one or more contact pads each of which is attached to a respective first contact pad;
- a reinforcement frame comprising one or more cavities, the reinforcement frame being attached to the first substrate, wherein at least part of each said module is located in a corresponding cavity in the reinforcement frame, wherein at least two said modules have different heights and are at least partially located in the same cavity in the reinforcement frame;
- wherein the reinforcement frame comprises a through-hole;
- and
- the assembly further comprises one or more heat sinks each of which overlies the through-hole, wherein at least one said heat sink overlying the through-hole is attached to the reinforcement frame and/or to at least one said module at least partially located in the through-hole, each said heat sink having a higher thermal conductivity than the reinforcement frame.
3 more elements
An assembly comprising:
- a first substrate comprising a first side and one or more first contact pads at the first side;
- one or more modules attached to the first substrate, each said module comprising a semiconductor integrated circuit, each said module comprising one or more contact pads each of which is attached to a respective first contact pad;
- and
- one or more reinforcement frames attached to the first substrate, each said reinforcement frame comprising one or more openings, at least part of each said module being located in a corresponding opening in a corresponding reinforcement frame;
- wherein in at least one said reinforcement frame, at least one said opening comprises a through-hole;
- and
- the assembly further comprises one or more heat sinks each of which overlies one or more of said through-holes in one or more of said reinforcement frames, wherein at least one said heat sink overlying at least one said through-hole in at least one said reinforcement frame is attached to the reinforcement frame and/or to at least one said module at least partially located in the through-hole, each said heat sink having a higher thermal conductivity than each said reinforcement frame.
4 more elements
A method for manufacturing an assembly, the method comprising:
- obtaining a first substrate comprising a first side and one or more first contact pads at the first side;
- obtaining one or more modules attached to the first substrate, each said module comprising a semiconductor integrated circuit, each said module comprising one or more contact pads each of which is attached to a respective first contact pad;
- and
- attaching one or more reinforcement frames to the first substrate, each said reinforcement frame comprising one or more openings, at least part of each said module being located in a corresponding opening in a corresponding reinforcement;
- wherein in at least one said reinforcement frame, at least one said opening comprises a through-hole;
- and
- the method further comprises attaching one or more heat sinks over one or more of said through-holes in one or more of said reinforcement frames, wherein at least one said heat sink overlying at least one said through-hole in at least one said reinforcement frame is attached to the reinforcement frame and/or to at least one said module at least partially located in the through-hole, each said heat sink having a higher thermal conductivity than each said reinforcement frame.
4 more elements
Dependencies are inferred from the claim text.