Optoelectronic semiconductor component, optoelectronic device, and method for producing an optoelectronic semiconductor component and/or optoelectronic device
Assigneeams-OSRAM International GmbH
InventorSiegfried Herrmann
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Abstract
The invention relates to an optoelectronic semiconductor component, comprising a support which has a support element and a first and second contact structure, an optoelectronic semiconductor chip which is arranged on the support and is connected to the first and second contact structure in an electrically conductive manner, and a housing which is connected to the support in a form-fitting manner and has a cavity that is laterally delimited by a reflective housing wall of the housing and is arranged on the face of a first main surface of the support, wherein the wall thickness of the housing.
Claims11
An optoelectronic semiconductor component, comprising:
- a carrier having a carrier element and first and second contact structures,
- an optoelectronic semiconductor chip, which is arranged on the carrier and is electrically conductively connected to the first and second contact structures,
- a package which is form-fittingly connected to the carrier and has a cavity which is laterally delimited by a reflective package wall of the package and is arranged on a side of a first main surface of the carrier, wherein a wall thickness of the reflective package wall lies in a single-digit or double-digit micrometer range, wherein:
- the package is arranged on the carrier, and the optoelectronic semiconductor chip and the first and second contact structures are arranged on a side of the carrier element facing away from the package, or
- the carrier is embedded in the package such that parts of the package are located on the first main surface and on a second main surface of the carrier.
Dependencies are inferred from the claim text.