Protective film agent, protective film forming method, and chip manufacturing method
AssigneeDisco Corporation
InventorSenichi Ryo
Life of this patent
Estimating the term…
Abstract
Provided is a protective film agent for forming a protective film on one surface of a workpiece before processing the workpiece, in which the protective film agent is a solution including water-soluble resin, water, and a light absorbent, the light absorbent has a flavone structure, a flavonol structure, or an isoflavone structure, and the protective film agent contains 52.00 parts by mass or more of the light absorbent relative to 100 parts by mass of the water-soluble resin. Incidentally, the water-soluble resin is polyvinyl alcohol, polyvinylpyrrolidone, hydroxypropyl cellulose, or polyoxazoline, for example. In addition, the light absorbent is αGR, for example.
Claims12
A protective film agent for forming a protective film on one surface of a workpiece before processing the workpiece,
- wherein the protective film agent is a solution including water-soluble resin, water, and a light absorbent,
- the light absorbent has a flavone structure, a flavonol structure, or an isoflavone structure, and
- the protective film agent contains 52.00 parts by mass or more of the light absorbent relative to 100 parts by mass of the water-soluble resin.
A chip manufacturing method for manufacturing chips by dividing a workpiece in which a plurality of devices are formed, along boundaries between the plurality of devices, the chip manufacturing method comprising:
- applying a protective film agent as a solution including water-soluble resin, water, and a light absorbent to one surface of the workpiece;
- forming a protective film by drying the protective film agent applied to the one surface;
- partially removing the protective film and partially exposing the workpiece by irradiating the workpiece with a pulsed laser beam having a wavelength that is absorbed by the light absorbent along the boundaries from the one surface side on which the protective film is formed;
- and
- dividing the workpiece into a plurality of chips by subjecting the workpiece to plasma etching with the partially removed protective film used as a mask,
- the light absorbent having a flavone structure, a flavonol structure, or an isoflavone structure, and
- the protective film agent containing 52.00 parts by mass or more of the light absorbent relative to 100 parts by mass of the water-soluble resin.
A chip manufacturing method for manufacturing chips by dividing a workpiece on which a plurality of devices are formed, along boundaries between the plurality of devices, the chip manufacturing method comprising:
- applying a protective film agent as a solution including water-soluble resin, water, and a light absorbent to one surface of the workpiece;
- forming a protective film by drying the protective film agent applied to the one surface;
- and
- partially removing each of the protective film and the workpiece and dividing the workpiece into a plurality of chips by irradiating the workpiece with a pulsed laser beam having a wavelength that is absorbed by each of the light absorbent and the workpiece along the boundaries from the one surface side on which the protective film is formed,
- the light absorbent having a flavone structure, a flavonol structure, or an isoflavone structure, and
- the protective film agent containing 52.00 parts by mass or more of the light absorbent relative to 100 parts by mass of the water-soluble resin.
Dependencies are inferred from the claim text.