H10P 50/00
Etching of wafers, substrates or parts of devices
H10P50/00 (Etching of wafers, substrates or parts of devices) appears on 36,730 US grants and 39,285 published applications in this corpus.
Search patents in H10P- Granted patents
- 36,730
- Published applications
- 39,285
- Assignees
- 3,269
- Inventors
- 43,825
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 69 | 0 |
| 1977 | 44 | 0 |
| 1978 | 64 | 0 |
| 1979 | 41 | 0 |
| 1980 | 61 | 0 |
| 1981 | 72 | 0 |
| 1982 | 80 | 0 |
| 1983 | 85 | 0 |
| 1984 | 100 | 0 |
| 1985 | 83 | 0 |
| 1986 | 96 | 0 |
| 1987 | 139 | 0 |
| 1988 | 80 | 0 |
| 1989 | 135 | 0 |
| 1990 | 126 | 0 |
| 1991 | 145 | 0 |
| 1992 | 151 | 0 |
| 1993 | 215 | 0 |
| 1994 | 243 | 0 |
| 1995 | 218 | 0 |
| 1996 | 126 | 0 |
| 1997 | 209 | 0 |
| 1998 | 266 | 0 |
| 1999 | 421 | 0 |
| 2000 | 603 | 0 |
| 2001 | 750 | 281 |
| 2002 | 758 | 788 |
| 2003 | 746 | 791 |
| 2004 | 712 | 989 |
| 2005 | 591 | 996 |
| 2006 | 629 | 924 |
| 2007 | 571 | 925 |
| 2008 | 514 | 957 |
| 2009 | 532 | 823 |
| 2010 | 682 | 771 |
| 2011 | 627 | 771 |
| 2012 | 703 | 951 |
| 2013 | 852 | 1197 |
| 2014 | 1101 | 1568 |
| 2015 | 1637 | 2603 |
| 2016 | 2429 | 2657 |
| 2017 | 2591 | 2618 |
| 2018 | 2238 | 2363 |
| 2019 | 2461 | 2648 |
| 2020 | 2554 | 2828 |
| 2021 | 2175 | 2212 |
| 2022 | 1679 | 2014 |
| 2023 | 1425 | 1825 |
| 2024 | 1482 | 1838 |
| 2025 | 1534 | 1765 |
| 2026 | 885 | 1182 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10P 50/20Dry etching22,805
- H10P 50/60Wet etching7,180
- H10P 50/73Etching of wafers, substrates or parts of devices: using masks for insulating7,031
- H10P 50/69Etching of wafers, substrates or parts of devices: using masks for semiconductor6,602
- H10P 50/71Etching of wafers, substrates or parts of devices: using masks for conductive3,991
Recent patents
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Assembly structure including a plurality of spacers and method of manufacturing the same6 Oct 2026US 12,757,375 B2Nanya Technology Corporation
- Method of manufacturing memory device6 Oct 2026US 12,757,394 B2Winbond Electronics Corp.
- Calabash-shaped MIM capacitor structure and fabricating method of the same6 Oct 2026US 12,757,418 B2United Microelectronics Corp.
- Composition for etching and method for manufacturing semiconductor device using same8 Oct 2026US 2026/0308450 A1Soulbrain Co., Ltd.
- Vapor-phase etch of metal-containing materials8 Oct 2026US 2026/0308770 A1Versum Materials US, LLC
- Resist underlayer film-forming composition8 Oct 2026US 2026/0310081 A1Nissan Chemical Corporation
- Lithography method8 Oct 2026US 2026/0310082 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing capacitor and method of manufacturing memory device8 Oct 2026US 2026/0313920 A1EGTM Co., Ltd.
Most cited
By later US patents
- Semiconductor device and manufacturing method thereof4,349US 7,674,650 B2Semiconductor Energy Laboratory Co.Ltd. · 2010
- Semiconductor device and manufacturing method thereof4,064US 7,732,819 B2Semiconductor Energy Laboratory Co.Ltd. · 2010
- Cut-mask patterning process for fin-like field effect transistor (FinFET) device3,286US 9,236,267 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Fin structure of FinFET1,337US 9,093,530 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015