H10P 50/20
Dry etching
Official title: Dry etching; Plasma etching; Reactive-ion etching
H10P50/20 (Dry etching) appears on 22,805 US grants and 24,525 published applications in this corpus.
Search patents in H10P- Granted patents
- 22,805
- Published applications
- 24,525
- Assignees
- 2,307
- Inventors
- 30,375
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 27 | 0 |
| 1977 | 21 | 0 |
| 1978 | 29 | 0 |
| 1979 | 21 | 0 |
| 1980 | 31 | 0 |
| 1981 | 40 | 0 |
| 1982 | 48 | 0 |
| 1983 | 56 | 0 |
| 1984 | 64 | 0 |
| 1985 | 56 | 0 |
| 1986 | 60 | 0 |
| 1987 | 89 | 0 |
| 1988 | 54 | 0 |
| 1989 | 96 | 0 |
| 1990 | 77 | 0 |
| 1991 | 89 | 0 |
| 1992 | 95 | 0 |
| 1993 | 141 | 0 |
| 1994 | 157 | 0 |
| 1995 | 139 | 0 |
| 1996 | 76 | 0 |
| 1997 | 145 | 0 |
| 1998 | 189 | 0 |
| 1999 | 293 | 0 |
| 2000 | 416 | 0 |
| 2001 | 514 | 187 |
| 2002 | 496 | 540 |
| 2003 | 506 | 547 |
| 2004 | 475 | 671 |
| 2005 | 384 | 657 |
| 2006 | 400 | 599 |
| 2007 | 377 | 573 |
| 2008 | 320 | 515 |
| 2009 | 312 | 432 |
| 2010 | 364 | 388 |
| 2011 | 287 | 413 |
| 2012 | 378 | 491 |
| 2013 | 417 | 618 |
| 2014 | 537 | 831 |
| 2015 | 890 | 1550 |
| 2016 | 1413 | 1533 |
| 2017 | 1529 | 1622 |
| 2018 | 1371 | 1503 |
| 2019 | 1544 | 1773 |
| 2020 | 1686 | 1879 |
| 2021 | 1450 | 1488 |
| 2022 | 1130 | 1336 |
| 2023 | 945 | 1218 |
| 2024 | 966 | 1226 |
| 2025 | 1017 | 1150 |
| 2026 | 588 | 785 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Method of fabricating transistors with implanting dopants at first and second dosages in the collector region to form the base region6 Oct 2026US 12,757,420 B2Texas Instruments Incorporated
- Method for manufacturing semiconductor structure with source/drain structure having modified shape6 Oct 2026US 12,757,422 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Enhancement-mode HEMT and manufacturing process of the same6 Oct 2026US 12,757,427 B2STMicroelectronics S,r.l.
- Semiconductor device and method of manufacturing the same6 Oct 2026US 12,757,470 B2Semes Co., Ltd.
- Composition for etching and method for manufacturing semiconductor device using same8 Oct 2026US 2026/0308450 A1Soulbrain Co., Ltd.
- Vapor-phase etch of metal-containing materials8 Oct 2026US 2026/0308770 A1Versum Materials US, LLC
- Method of manufacturing capacitor and method of manufacturing memory device8 Oct 2026US 2026/0313920 A1EGTM Co., Ltd.
- Semiconductor device and manufacturing method thereof8 Oct 2026US 2026/0313928 A1National Taiwan University
- Methods of forming semiconductor devices8 Oct 2026US 2026/0313934 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Semiconductor device and manufacturing method thereof4,349US 7,674,650 B2Semiconductor Energy Laboratory Co.Ltd. · 2010
- Semiconductor device and manufacturing method thereof4,064US 7,732,819 B2Semiconductor Energy Laboratory Co.Ltd. · 2010
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Method for depositing an amorphous carbon layer1,124US 6,573,030 B1APPLIED Materials.Inc. · 2003
- Semiconductor device and manufacturing method thereof849US 7,910,490 B2Semiconductor Energy Laboratory Co.Ltd. · 2011