H10P 50/26
Of conductive or resistive materials
Official title: of conductive or resistive materials
H10P50/26 (Of conductive or resistive materials) appears on 5,275 US grants and 5,126 published applications in this corpus.
Search patents in H10P- Granted patents
- 5,275
- Published applications
- 5,126
- Assignees
- 799
- Inventors
- 9,096
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 8 | 0 |
| 1978 | 8 | 0 |
| 1979 | 6 | 0 |
| 1980 | 9 | 0 |
| 1981 | 13 | 0 |
| 1982 | 16 | 0 |
| 1983 | 22 | 0 |
| 1984 | 24 | 0 |
| 1985 | 18 | 0 |
| 1986 | 16 | 0 |
| 1987 | 26 | 0 |
| 1988 | 16 | 0 |
| 1989 | 31 | 0 |
| 1990 | 13 | 0 |
| 1991 | 23 | 0 |
| 1992 | 40 | 0 |
| 1993 | 54 | 0 |
| 1994 | 51 | 0 |
| 1995 | 46 | 0 |
| 1996 | 25 | 0 |
| 1997 | 63 | 0 |
| 1998 | 61 | 0 |
| 1999 | 95 | 0 |
| 2000 | 130 | 0 |
| 2001 | 138 | 41 |
| 2002 | 131 | 170 |
| 2003 | 150 | 143 |
| 2004 | 149 | 183 |
| 2005 | 105 | 158 |
| 2006 | 91 | 131 |
| 2007 | 90 | 139 |
| 2008 | 82 | 114 |
| 2009 | 74 | 96 |
| 2010 | 95 | 65 |
| 2011 | 68 | 88 |
| 2012 | 72 | 84 |
| 2013 | 82 | 107 |
| 2014 | 99 | 172 |
| 2015 | 186 | 364 |
| 2016 | 352 | 351 |
| 2017 | 304 | 290 |
| 2018 | 245 | 279 |
| 2019 | 324 | 378 |
| 2020 | 370 | 382 |
| 2021 | 287 | 303 |
| 2022 | 241 | 279 |
| 2023 | 198 | 263 |
| 2024 | 203 | 216 |
| 2025 | 203 | 216 |
| 2026 | 119 | 114 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Semiconductor device and method of manufacturing the same6 Oct 2026US 12,757,470 B2Semes Co., Ltd.
- Semiconductor device with catalytic conductive layer and method for fabricating the same6 Oct 2026US 12,757,692 B2Nanya Technology Corporation
- Semiconductor device with catalytic conductive layer and method for fabricating the same6 Oct 2026US 12,757,693 B2Nanya Technology Corporation
- Method for fabricating semiconductor device with protection liner for bit line6 Oct 2026US 12,757,695 B2Nanya Technology Corporation
- Vapor-phase etch of metal-containing materials8 Oct 2026US 2026/0308770 A1Versum Materials US, LLC
- Method of manufacturing capacitor and method of manufacturing memory device8 Oct 2026US 2026/0313920 A1EGTM Co., Ltd.
- Methods and systems for dry etching8 Oct 2026US 2026/0314324 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Etching method and etching apparatus1 Oct 2026US 2026/0305203 A1Hitachi High-Tech Corporation
- Systems and methods for etching a high aspect ratio structure1 Oct 2026US 2026/0305206 A1Lam Research Corporation
Most cited
By later US patents
- Method for depositing an amorphous carbon layer1,124US 6,573,030 B1APPLIED Materials.Inc. · 2003
- Method of selectively etching titanium-containing materials on a semiconductor wafer using remote plasma generation778US 5,326,427 ALSI Logic Corporation · 1994
- Method and apparatus for surface treatment by plasma617US 4,579,623 AHitachi, Ltd. · 1986
- Photochemical vapor phase reaction apparatus and method of causing a photochemical vapor phase reaction583US 5,288,684 ASemiconductor Energy Laboratory Co.Ltd. · 1994
- Plasma treatment method and apparatus581US 5,242,539 AHitachi, Ltd. · 1993