H10P 50/264
By chemical means
Official title: {by chemical means}
H10P50/264 (By chemical means) appears on 5,093 US grants and 4,984 published applications in this corpus.
Search patents in H10P- Granted patents
- 5,093
- Published applications
- 4,984
- Assignees
- 765
- Inventors
- 8,769
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 8 | 0 |
| 1981 | 11 | 0 |
| 1982 | 14 | 0 |
| 1983 | 21 | 0 |
| 1984 | 23 | 0 |
| 1985 | 18 | 0 |
| 1986 | 15 | 0 |
| 1987 | 23 | 0 |
| 1988 | 16 | 0 |
| 1989 | 31 | 0 |
| 1990 | 12 | 0 |
| 1991 | 22 | 0 |
| 1992 | 40 | 0 |
| 1993 | 53 | 0 |
| 1994 | 51 | 0 |
| 1995 | 45 | 0 |
| 1996 | 25 | 0 |
| 1997 | 61 | 0 |
| 1998 | 59 | 0 |
| 1999 | 94 | 0 |
| 2000 | 124 | 0 |
| 2001 | 136 | 41 |
| 2002 | 128 | 164 |
| 2003 | 145 | 140 |
| 2004 | 145 | 176 |
| 2005 | 101 | 154 |
| 2006 | 85 | 121 |
| 2007 | 89 | 137 |
| 2008 | 79 | 112 |
| 2009 | 69 | 93 |
| 2010 | 90 | 61 |
| 2011 | 66 | 86 |
| 2012 | 66 | 81 |
| 2013 | 79 | 105 |
| 2014 | 95 | 166 |
| 2015 | 178 | 355 |
| 2016 | 342 | 341 |
| 2017 | 295 | 282 |
| 2018 | 234 | 273 |
| 2019 | 318 | 371 |
| 2020 | 363 | 369 |
| 2021 | 281 | 290 |
| 2022 | 232 | 273 |
| 2023 | 191 | 258 |
| 2024 | 196 | 213 |
| 2025 | 199 | 212 |
| 2026 | 116 | 110 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Semiconductor device and method of manufacturing the same6 Oct 2026US 12,757,470 B2Semes Co., Ltd.
- Semiconductor device with catalytic conductive layer and method for fabricating the same6 Oct 2026US 12,757,692 B2Nanya Technology Corporation
- Semiconductor device with catalytic conductive layer and method for fabricating the same6 Oct 2026US 12,757,693 B2Nanya Technology Corporation
- Method for fabricating semiconductor device with protection liner for bit line6 Oct 2026US 12,757,695 B2Nanya Technology Corporation
- Vapor-phase etch of metal-containing materials8 Oct 2026US 2026/0308770 A1Versum Materials US, LLC
- Method of manufacturing capacitor and method of manufacturing memory device8 Oct 2026US 2026/0313920 A1EGTM Co., Ltd.
- Methods and systems for dry etching8 Oct 2026US 2026/0314324 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Etching method and etching apparatus1 Oct 2026US 2026/0305203 A1Hitachi High-Tech Corporation
- Systems and methods for etching a high aspect ratio structure1 Oct 2026US 2026/0305206 A1Lam Research Corporation
Most cited
By later US patents
- Method for depositing an amorphous carbon layer1,124US 6,573,030 B1APPLIED Materials.Inc. · 2003
- Method of selectively etching titanium-containing materials on a semiconductor wafer using remote plasma generation778US 5,326,427 ALSI Logic Corporation · 1994
- Method and apparatus for surface treatment by plasma617US 4,579,623 AHitachi, Ltd. · 1986
- Photochemical vapor phase reaction apparatus and method of causing a photochemical vapor phase reaction583US 5,288,684 ASemiconductor Energy Laboratory Co.Ltd. · 1994
- Plasma treatment method and apparatus581US 5,242,539 AHitachi, Ltd. · 1993