H10P 50/60
Wet etching
H10P50/60 (Wet etching) appears on 7,180 US grants and 7,557 published applications in this corpus.
Search patents in H10P- Granted patents
- 7,180
- Published applications
- 7,557
- Assignees
- 1,266
- Inventors
- 11,917
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 29 | 0 |
| 1977 | 20 | 0 |
| 1978 | 32 | 0 |
| 1979 | 21 | 0 |
| 1980 | 26 | 0 |
| 1981 | 26 | 0 |
| 1982 | 30 | 0 |
| 1983 | 30 | 0 |
| 1984 | 26 | 0 |
| 1985 | 12 | 0 |
| 1986 | 23 | 0 |
| 1987 | 33 | 0 |
| 1988 | 11 | 0 |
| 1989 | 27 | 0 |
| 1990 | 27 | 0 |
| 1991 | 26 | 0 |
| 1992 | 30 | 0 |
| 1993 | 39 | 0 |
| 1994 | 35 | 0 |
| 1995 | 31 | 0 |
| 1996 | 18 | 0 |
| 1997 | 23 | 0 |
| 1998 | 36 | 0 |
| 1999 | 47 | 0 |
| 2000 | 84 | 0 |
| 2001 | 84 | 37 |
| 2002 | 118 | 124 |
| 2003 | 95 | 109 |
| 2004 | 105 | 146 |
| 2005 | 90 | 156 |
| 2006 | 83 | 139 |
| 2007 | 79 | 113 |
| 2008 | 71 | 138 |
| 2009 | 81 | 111 |
| 2010 | 94 | 116 |
| 2011 | 102 | 123 |
| 2012 | 96 | 167 |
| 2013 | 142 | 258 |
| 2014 | 200 | 315 |
| 2015 | 373 | 640 |
| 2016 | 584 | 644 |
| 2017 | 617 | 661 |
| 2018 | 574 | 521 |
| 2019 | 549 | 535 |
| 2020 | 524 | 566 |
| 2021 | 451 | 433 |
| 2022 | 332 | 381 |
| 2023 | 279 | 332 |
| 2024 | 277 | 314 |
| 2025 | 282 | 277 |
| 2026 | 156 | 201 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Calabash-shaped MIM capacitor structure and fabricating method of the same6 Oct 2026US 12,757,418 B2United Microelectronics Corp.
- Semiconductor device with catalytic conductive layer and method for fabricating the same6 Oct 2026US 12,757,692 B2Nanya Technology Corporation
- Semiconductor device with catalytic conductive layer and method for fabricating the same6 Oct 2026US 12,757,693 B2Nanya Technology Corporation
- Transducers including laser etched substrates29 Sep 2026US 12,751,228 B2Baker Hughes Oilfield Operations LLC
- Composition for etching and method for manufacturing semiconductor device using same8 Oct 2026US 2026/0308450 A1Soulbrain Co., Ltd.
- Methods of forming semiconductor devices8 Oct 2026US 2026/0313934 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and method for forming the same8 Oct 2026US 2026/0314008 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure having self-aligned insulating feature and methods for manufacturing the same8 Oct 2026US 2026/0314012 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Trench isolation with conductive structures8 Oct 2026US 2026/0314033 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Fin structure of FinFET1,337US 9,093,530 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Contact structure of semiconductor device1,334US 8,823,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- FinFET device having a channel defined in a diamond-like shape semiconductor structure537US 8,841,701 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- FinFETs with contact-all-around532US 9,406,804 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016