H10P 50/64
Of semiconductor materials
Official title: of semiconductor materials
H10P50/64 (Of semiconductor materials) appears on 5,184 US grants and 5,439 published applications in this corpus.
Search patents in H10P- Granted patents
- 5,184
- Published applications
- 5,439
- Assignees
- 988
- Inventors
- 8,404
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 22 | 0 |
| 1977 | 13 | 0 |
| 1978 | 22 | 0 |
| 1979 | 13 | 0 |
| 1980 | 15 | 0 |
| 1981 | 13 | 0 |
| 1982 | 18 | 0 |
| 1983 | 14 | 0 |
| 1984 | 12 | 0 |
| 1985 | 6 | 0 |
| 1986 | 15 | 0 |
| 1987 | 16 | 0 |
| 1988 | 7 | 0 |
| 1989 | 18 | 0 |
| 1990 | 20 | 0 |
| 1991 | 18 | 0 |
| 1992 | 21 | 0 |
| 1993 | 23 | 0 |
| 1994 | 23 | 0 |
| 1995 | 19 | 0 |
| 1996 | 9 | 0 |
| 1997 | 13 | 0 |
| 1998 | 29 | 0 |
| 1999 | 30 | 0 |
| 2000 | 47 | 0 |
| 2001 | 39 | 12 |
| 2002 | 46 | 41 |
| 2003 | 36 | 36 |
| 2004 | 31 | 52 |
| 2005 | 35 | 72 |
| 2006 | 37 | 63 |
| 2007 | 38 | 59 |
| 2008 | 25 | 67 |
| 2009 | 38 | 68 |
| 2010 | 54 | 63 |
| 2011 | 57 | 87 |
| 2012 | 57 | 114 |
| 2013 | 100 | 192 |
| 2014 | 149 | 249 |
| 2015 | 297 | 505 |
| 2016 | 477 | 538 |
| 2017 | 531 | 587 |
| 2018 | 496 | 436 |
| 2019 | 438 | 414 |
| 2020 | 417 | 432 |
| 2021 | 355 | 329 |
| 2022 | 248 | 266 |
| 2023 | 216 | 232 |
| 2024 | 198 | 222 |
| 2025 | 200 | 190 |
| 2026 | 113 | 113 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Calabash-shaped MIM capacitor structure and fabricating method of the same6 Oct 2026US 12,757,418 B2United Microelectronics Corp.
- Semiconductor device with catalytic conductive layer and method for fabricating the same6 Oct 2026US 12,757,692 B2Nanya Technology Corporation
- Semiconductor device with catalytic conductive layer and method for fabricating the same6 Oct 2026US 12,757,693 B2Nanya Technology Corporation
- Transducers including laser etched substrates29 Sep 2026US 12,751,228 B2Baker Hughes Oilfield Operations LLC
- Composition for etching and method for manufacturing semiconductor device using same8 Oct 2026US 2026/0308450 A1Soulbrain Co., Ltd.
- Methods of forming semiconductor devices8 Oct 2026US 2026/0313934 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and method for forming the same8 Oct 2026US 2026/0314008 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure having self-aligned insulating feature and methods for manufacturing the same8 Oct 2026US 2026/0314012 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for forming source/drain contacts8 Oct 2026US 2026/0314054 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Fin structure of FinFET1,337US 9,093,530 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Contact structure of semiconductor device1,334US 8,823,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- FinFET device having a channel defined in a diamond-like shape semiconductor structure537US 8,841,701 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- FinFETs with contact-all-around532US 9,406,804 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016