H10P 50/69
Etching of wafers, substrates or parts of devices: using masks for semiconductor
Official title: {using masks for semiconductor materials}
H10P50/69 (Etching of wafers, substrates or parts of devices: using masks for semiconductor) appears on 6,602 US grants and 7,111 published applications in this corpus.
Search patents in H10P- Granted patents
- 6,602
- Published applications
- 7,111
- Assignees
- 990
- Inventors
- 10,530
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 18 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 10 | 0 |
| 1982 | 11 | 0 |
| 1983 | 5 | 0 |
| 1984 | 9 | 0 |
| 1985 | 13 | 0 |
| 1986 | 17 | 0 |
| 1987 | 25 | 0 |
| 1988 | 21 | 0 |
| 1989 | 15 | 0 |
| 1990 | 22 | 0 |
| 1991 | 30 | 0 |
| 1992 | 25 | 0 |
| 1993 | 28 | 0 |
| 1994 | 30 | 0 |
| 1995 | 30 | 0 |
| 1996 | 11 | 0 |
| 1997 | 23 | 0 |
| 1998 | 21 | 0 |
| 1999 | 34 | 0 |
| 2000 | 31 | 0 |
| 2001 | 57 | 20 |
| 2002 | 58 | 57 |
| 2003 | 50 | 59 |
| 2004 | 62 | 88 |
| 2005 | 62 | 95 |
| 2006 | 69 | 94 |
| 2007 | 56 | 113 |
| 2008 | 55 | 116 |
| 2009 | 48 | 102 |
| 2010 | 95 | 128 |
| 2011 | 106 | 136 |
| 2012 | 105 | 166 |
| 2013 | 155 | 221 |
| 2014 | 235 | 402 |
| 2015 | 431 | 630 |
| 2016 | 620 | 633 |
| 2017 | 627 | 640 |
| 2018 | 548 | 493 |
| 2019 | 534 | 539 |
| 2020 | 513 | 527 |
| 2021 | 421 | 375 |
| 2022 | 269 | 355 |
| 2023 | 271 | 330 |
| 2024 | 288 | 323 |
| 2025 | 264 | 300 |
| 2026 | 155 | 169 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Assembly structure including a plurality of spacers and method of manufacturing the same6 Oct 2026US 12,757,375 B2Nanya Technology Corporation
- Method of manufacturing memory device6 Oct 2026US 12,757,394 B2Winbond Electronics Corp.
- Enhancement-mode HEMT and manufacturing process of the same6 Oct 2026US 12,757,427 B2STMicroelectronics S,r.l.
- Semiconductor device, semiconductor structure and method for fabricating semiconductor device and semiconductor structure using tilted etch process6 Oct 2026US 12,757,661 B2Nanya Technology Corporation
- Method of manufacturing semiconductor device6 Oct 2026US 12,757,741 B2Samsung Electronics Co., Ltd.
- Epitaxial structures grown on material with a crystallographic orientation of {110}8 Oct 2026US 2026/0313994 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and method for forming the same8 Oct 2026US 2026/0314008 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of forming the same8 Oct 2026US 2026/0314051 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Base film agent and processing method for workpiece8 Oct 2026US 2026/0314287 A1Disco Corporation
- Method for producing semiconductor device and layered object for semiconductor device8 Oct 2026US 2026/0314322 A1Mitsui Chemicals, Inc.
Most cited
By later US patents
- Cut-mask patterning process for fin-like field effect transistor (FinFET) device3,286US 9,236,267 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Method for depositing an amorphous carbon layer1,124US 6,573,030 B1APPLIED Materials.Inc. · 2003
- Method for reducing, by a factor or 2.sup.-N, the minimum masking pitch of a photolithographic process1,059US 5,328,810 AMicron Technology, Inc. · 1994
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009