H10W 20/031
Of conductive parts of the interconnections
Official title: {of conductive parts of the interconnections}
H10W20/031 (Of conductive parts of the interconnections) appears on 31,956 US grants and 32,678 published applications in this corpus.
Search patents in H10W- Granted patents
- 31,956
- Published applications
- 32,678
- Assignees
- 2,239
- Inventors
- 30,741
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 16 | 0 |
| 1978 | 23 | 0 |
| 1979 | 12 | 0 |
| 1980 | 16 | 0 |
| 1981 | 23 | 0 |
| 1982 | 38 | 0 |
| 1983 | 25 | 0 |
| 1984 | 47 | 0 |
| 1985 | 44 | 0 |
| 1986 | 51 | 0 |
| 1987 | 70 | 0 |
| 1988 | 72 | 0 |
| 1989 | 101 | 0 |
| 1990 | 127 | 0 |
| 1991 | 125 | 0 |
| 1992 | 143 | 0 |
| 1993 | 198 | 0 |
| 1994 | 185 | 0 |
| 1995 | 205 | 0 |
| 1996 | 202 | 0 |
| 1997 | 260 | 0 |
| 1998 | 331 | 0 |
| 1999 | 543 | 0 |
| 2000 | 866 | 0 |
| 2001 | 1082 | 408 |
| 2002 | 1102 | 1142 |
| 2003 | 954 | 1007 |
| 2004 | 970 | 1153 |
| 2005 | 793 | 1211 |
| 2006 | 754 | 1123 |
| 2007 | 720 | 1051 |
| 2008 | 655 | 1016 |
| 2009 | 635 | 793 |
| 2010 | 787 | 713 |
| 2011 | 680 | 614 |
| 2012 | 594 | 762 |
| 2013 | 718 | 857 |
| 2014 | 920 | 1189 |
| 2015 | 1132 | 1563 |
| 2016 | 1517 | 1482 |
| 2017 | 1681 | 1635 |
| 2018 | 1518 | 1594 |
| 2019 | 1617 | 1712 |
| 2020 | 1656 | 1903 |
| 2021 | 1536 | 1820 |
| 2022 | 1304 | 1887 |
| 2023 | 1285 | 1804 |
| 2024 | 1448 | 1833 |
| 2025 | 1367 | 1623 |
| 2026 | 803 | 783 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 20/056By filling conductive material into holes, grooves or trenches12,152
- H10W 20/032Of conductive barrier, adhesion or liner layers11,785
- H10W 20/069By forming self-aligned vias or self-aligned contact plugs7,314
- H10W 20/0698Local interconnections4,630
- H10W 20/063By forming conductive members before forming protective insulating material3,454
- H10W 20/062By smoothing of conductive parts2,722
- H10W 20/064By modifying the conductivity of conductive parts2,130
- H10W 20/067By modifying the pattern of conductive parts756
All 9 subgroupsShow fewer
Recent patents
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- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Semiconductor devices and methods of fabricating the same8 Oct 2026US 2026/0313865 A1Samsung Electronics Co., Ltd.
- FINFET Devices with Backside Power Rail and Backside Self-Aligned Via8 Oct 2026US 2026/0313945 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device with backside interconnection and method for forming the same8 Oct 2026US 2026/0313967 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure including cap layer of two-dimensional material and method for manufacturing the same8 Oct 2026US 2026/0314350 A1Taiwan Semiconductor Manufacturing Company.Ltd
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Most cited
By later US patents
- Contact structure of semiconductor device1,648US 9,105,490 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Contact plugs in SRAM cells and the method of forming the same1,465US 9,236,300 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Contact structure of semiconductor device1,334US 8,823,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Atomic layer deposition with nitrate containing precursors1,176US 6,203,613 B1International Business Machines Corporation · 2001
- Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers1,159US 5,278,100 AMicron Technology, Inc. · 1994