H10W 20/069
By forming self-aligned vias or self-aligned contact plugs
Official title: {by forming self-aligned vias or self-aligned contact plugs}
H10W20/069 (By forming self-aligned vias or self-aligned contact plugs) appears on 7,314 US grants and 7,677 published applications in this corpus.
Search patents in H10W- Granted patents
- 7,314
- Published applications
- 7,677
- Assignees
- 522
- Inventors
- 7,740
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 6 | 0 |
| 1983 | 2 | 0 |
| 1984 | 11 | 0 |
| 1985 | 5 | 0 |
| 1986 | 7 | 0 |
| 1987 | 16 | 0 |
| 1988 | 25 | 0 |
| 1989 | 20 | 0 |
| 1990 | 31 | 0 |
| 1991 | 31 | 0 |
| 1992 | 35 | 0 |
| 1993 | 36 | 0 |
| 1994 | 28 | 0 |
| 1995 | 38 | 0 |
| 1996 | 29 | 0 |
| 1997 | 35 | 0 |
| 1998 | 48 | 0 |
| 1999 | 87 | 0 |
| 2000 | 163 | 0 |
| 2001 | 243 | 81 |
| 2002 | 249 | 253 |
| 2003 | 177 | 167 |
| 2004 | 191 | 216 |
| 2005 | 149 | 185 |
| 2006 | 152 | 156 |
| 2007 | 89 | 126 |
| 2008 | 82 | 133 |
| 2009 | 94 | 98 |
| 2010 | 115 | 78 |
| 2011 | 84 | 101 |
| 2012 | 80 | 118 |
| 2013 | 108 | 167 |
| 2014 | 154 | 189 |
| 2015 | 215 | 317 |
| 2016 | 381 | 376 |
| 2017 | 410 | 410 |
| 2018 | 411 | 434 |
| 2019 | 436 | 454 |
| 2020 | 477 | 572 |
| 2021 | 444 | 539 |
| 2022 | 420 | 551 |
| 2023 | 378 | 582 |
| 2024 | 445 | 623 |
| 2025 | 443 | 558 |
| 2026 | 224 | 193 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor structure and method of manufacturing the same6 Oct 2026US 12,757,723 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Contact plug structure of semiconductor device and method of forming same29 Sep 2026US 12,751,040 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Local line extension for enlarged via-to-line contact area29 Sep 2026US 12,751,263 B2International Business Machines Corporation
- Semiconductor transistor structure and fabrication method thereof22 Sep 2026US 12,745,443 B2United Microelectronics Corp.
- Semiconductor device structure with liner layer having tapered sidewall and method for preparing the same8 Sep 2026US 12,733,471 B2Nanya Technology Corporation
- FINFET Devices with Backside Power Rail and Backside Self-Aligned Via8 Oct 2026US 2026/0313945 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Doping free connection structures and methods8 Oct 2026US 2026/0314361 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Structure and Method for Deep Trench Capacitor with Reduced Deformation1 Oct 2026US 2026/0304797 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure including a bit line structure and method of manufacturing the same24 Sep 2026US 2026/0293116 A1Nanya Technology Corporation
- High density capacitor implemented using finfet24 Sep 2026US 2026/0293169 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Contact plugs in SRAM cells and the method of forming the same1,465US 9,236,300 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Self aligned contact scheme568US 9,548,366 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Gas pulsing for etch profile control550US 6,784,108 B1Micron Technology, Inc. · 2004
- Method of forming self-aligned contacts and local interconnects549US 8,076,230 B2Macronix International Co., Ltd. · 2011
- Method of manufacturing a semiconductor device533US 5,098,638 AMatsushita Electric Industrial Co., Ltd. · 1992