Semiconductor transistor structure and fabrication method thereof
AssigneeUnited Microelectronics Corp.
InventorsKuan-Liang Liu, Szu-Han Huang
Life of this patent
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Abstract
A semiconductor transistor structure includes a semiconductor substrate having an active area and a trench isolation region surrounding the active area; a first inter-layer dielectric (ILD) layer covering the semiconductor substrate; a metal gate embedded in the first ILD layer and overlying the active area and the trench isolation region, wherein the metal gate comprises a first portion disposed directly above the active area and a second portion disposed directly above the trench isolation region, wherein the first portion is thicker than the second portion; a hard mask layer disposed on the second portion; and a gate dielectric layer disposed between the first portion of the metal gate and the active area.
Claims16
A semiconductor transistor structure, comprising:
- a semiconductor substrate having an active area and a trench isolation region surrounding the active area;
- a first inter-layer dielectric (ILD) layer covering the semiconductor substrate;
- a metal gate embedded in the first ILD layer and overlying the active area and the trench isolation region, wherein the metal gate comprises a first portion disposed directly above the active area and a second portion disposed directly above the trench isolation region, wherein the first portion is thicker than the second portion;
- a hard mask layer disposed on the second portion of the metal gate;
- a gate dielectric layer disposed between the first portion of the metal gate and the active area;
- a source doping region disposed on a first side of the metal gate;
- a drain doping region disposed on an opposing second side of the metal gate
- a second inter-layer dielectric (ILD) layer covering the first ILD layer, the hard mask layer, and the metal gate;
- and
- a contact plug embedded in the second ILD layer and extending into the hard mask layer to electrically contact with the second portion of the metal gate.
A method of forming a semiconductor transistor structure, comprising:
- providing a semiconductor substrate having an active area and a trench isolation region surrounding the active area;
- forming a first inter-layer dielectric (ILD) layer covering the semiconductor substrate;
- forming a metal gate embedded in the first ILD layer and overlying the active area and the trench isolation region, wherein the metal gate comprises a first portion disposed directly above the active area and a second portion disposed directly above the trench isolation region, wherein the first portion is thicker than the second portion;
- forming a source doping region on a first side of the metal gate;
- forming a drain doping region on an opposing second side of the metal gate;
- forming a hard mask layer on the second portion of the metal gate;
- and
- forming a gate dielectric layer between the first portion of the metal gate and the active area;
- forming a second inter-layer dielectric (ILD) layer covering the first ILD layer, the hard mask layer, and the metal gate;
- and
- forming a contact plug embedded in the second ILD layer and extending into the hard mask layer to electrically contact with the second portion of the metal gate.
Dependencies are inferred from the claim text.