Local line extension for enlarged via-to-line contact area

An interconnect structure, comprising:

• a first metal layer comprising at least one metal wire with a first segment and a local extension having a width in a first direction that is larger than a width of the first segment, wherein the at least one metal wire of the first metal layer is part of a plurality of metal wires arranged at a minimum wire pitch capability of the first metal layer;
• a second metal layer on top or below the first metal layer comprising at least one metal wire;
• a via connected between the at least one metal wire of the first metal layer and the at least one metal wire of the second metal layer, wherein a width of the via in the first direction is larger than the width of the first segment but smaller than a width of the local extension.

An interconnect structure, comprising:

• a first metal layer comprising at least one metal wire with a first segment and a local extension having a width in a first direction that is larger than a width of the first segment;
• a second metal layer on top or below the first metal layer comprising at least one metal wire;
• a via connected between the at least one metal wire of the first metal layer and the at least one metal wire of the second metal layer, wherein a width of the via in the first direction is larger than the width of the first segment but smaller than a width of the local extension, wherein the via is not self-aligned to the at least one metal wire of the first metal layer.