H10W 20/0693
By forming self-aligned vias
Official title: {by forming self-aligned vias}
H10W20/0693 (By forming self-aligned vias) appears on 1,399 US grants and 1,507 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,399
- Published applications
- 1,507
- Assignees
- 146
- Inventors
- 1,527
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 6 | 0 |
| 1991 | 6 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 0 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 9 | 0 |
| 1998 | 3 | 0 |
| 1999 | 10 | 0 |
| 2000 | 18 | 0 |
| 2001 | 26 | 11 |
| 2002 | 31 | 28 |
| 2003 | 14 | 16 |
| 2004 | 20 | 27 |
| 2005 | 16 | 21 |
| 2006 | 21 | 16 |
| 2007 | 13 | 5 |
| 2008 | 7 | 6 |
| 2009 | 7 | 14 |
| 2010 | 9 | 4 |
| 2011 | 6 | 6 |
| 2012 | 10 | 21 |
| 2013 | 11 | 25 |
| 2014 | 26 | 28 |
| 2015 | 28 | 37 |
| 2016 | 51 | 53 |
| 2017 | 63 | 75 |
| 2018 | 74 | 89 |
| 2019 | 110 | 127 |
| 2020 | 118 | 146 |
| 2021 | 135 | 194 |
| 2022 | 136 | 153 |
| 2023 | 104 | 159 |
| 2024 | 127 | 132 |
| 2025 | 119 | 86 |
| 2026 | 44 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Via alignment in single damascene structure25 Aug 2026US 12,721,124 B2International Business Machines Corporation
- Topological semi-metal interconnects25 Aug 2026US 12,721,153 B2International Business Machines Corporation
- Heterogeneous metal line compositions for advanced integrated circuit structure fabrication11 Aug 2026US 12,707,697 B2Intel Corporation
- Integrated circuit devices including metal structures having a curved interface and methods of forming the same11 Aug 2026US 12,707,946 B2Samsung Electronics Co., Ltd.
- Wet recess for Ru subtractive process4 Aug 2026US 12,701,986 B2Samsung Electronics Co., Ltd.
- Semiconductor device with self-aligned vias27 Aug 2026US 2026/0255940 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Interconnect structure27 Aug 2026US 2026/0255947 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device structure and methods of forming the same6 Aug 2026US 2026/0231750 A1
- Damascene processes30 Jul 2026US 2026/0223653 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit devices including a conductive via and methods of forming the same30 Jul 2026US 2026/0223658 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method for maximizing air gap in back end of the line interconnect through via landing modification318US 9,837,355 B2International Business Machines Corporation · 2017
- Aluminum-palladium alloy for initiation of electroless plating257US 5,907,790 AAstarix Inc. · 1999
- Process for fabricating multi-level integrated circuit wiring structure from a single metal deposit167US 4,962,058 AInternational Business Machines Corporation · 1990
- Self-aligned contacts134US 8,436,404 B2Intel Corporation · 2013
- Reverse damascene via structures128US 5,693,568 AAdvanced Micro Devices, Inc. · 1997