H10W 20/032
Of conductive barrier, adhesion or liner layers
Official title: {of conductive barrier, adhesion or liner layers}
H10W20/032 (Of conductive barrier, adhesion or liner layers) appears on 11,785 US grants and 13,003 published applications in this corpus.
Search patents in H10W- Granted patents
- 11,785
- Published applications
- 13,003
- Assignees
- 990
- Inventors
- 13,390
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 13 | 0 |
| 1991 | 11 | 0 |
| 1992 | 19 | 0 |
| 1993 | 28 | 0 |
| 1994 | 39 | 0 |
| 1995 | 41 | 0 |
| 1996 | 53 | 0 |
| 1997 | 65 | 0 |
| 1998 | 88 | 0 |
| 1999 | 166 | 0 |
| 2000 | 280 | 0 |
| 2001 | 383 | 157 |
| 2002 | 378 | 405 |
| 2003 | 337 | 350 |
| 2004 | 336 | 414 |
| 2005 | 288 | 469 |
| 2006 | 270 | 485 |
| 2007 | 296 | 482 |
| 2008 | 277 | 487 |
| 2009 | 282 | 413 |
| 2010 | 382 | 350 |
| 2011 | 349 | 271 |
| 2012 | 286 | 336 |
| 2013 | 302 | 317 |
| 2014 | 358 | 459 |
| 2015 | 420 | 635 |
| 2016 | 578 | 558 |
| 2017 | 635 | 612 |
| 2018 | 548 | 613 |
| 2019 | 614 | 664 |
| 2020 | 643 | 795 |
| 2021 | 609 | 677 |
| 2022 | 514 | 753 |
| 2023 | 488 | 744 |
| 2024 | 554 | 679 |
| 2025 | 517 | 572 |
| 2026 | 317 | 306 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 20/033In openings in dielectrics8,928
- H10W 20/042The barrier, adhesion or liner layers being seed or nucleation layers2,891
- H10W 20/047By introducing additional elements therein2,618
- H10W 20/038Covering conductive structures1,571
- H10W 20/052By treatments not introducing additional elements therein1,502
- H10W 20/054By selectively removing parts thereof1,007
- H10W 20/055By formation methods other than physical vapour deposition [pvd], chemical vapour deposition840
- H10W 20/046The barrier, adhesion or liner layers being associated with interconnections of capacitors326
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- Package structure and method for fabricating the same8 Oct 2026US 2026/0314354 A1National Yang Ming.Chiao Tung University
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Most cited
By later US patents
- Contact structure of semiconductor device1,648US 9,105,490 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Contact structure of semiconductor device1,334US 8,823,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Atomic layer deposition with nitrate containing precursors1,176US 6,203,613 B1International Business Machines Corporation · 2001
- Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers1,159US 5,278,100 AMicron Technology, Inc. · 1994
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015