Semiconductor device with polymer liner and method for fabricating the same

A semiconductor device, comprising:

• a first semiconductor chip comprising a first substrate having a front side and a back side parallel to the front side;
• a first passivation layer positioned over the front side of the first substrate and a second passivation layer positioned over the back side of the first substrate, wherein the second passivation layer has a top surface facing away from the first substrate;
• a conductive feature positioned in the first passivation layer and a through substrate via (TSV) exposed through the second passivation layer and electrically coupled to the conductive feature;
• a polymer liner positioned between the TSV and the first substrate;
• a barrier layer positioned between the second passivation layer and the TSV, between the polymer liner and the TSV, and between the conductive feature and the TSV;
• an adhesion layer positioned between the barrier layer and the TSV;
• and
• a second semiconductor chip coupled to the first semiconductor chip at a bonding interface and comprising a second substrate coupled to the first substrate;
• wherein a top surface of the barrier layer is formed at the bonding interface and is coupled to the second semiconductor chip;
• wherein the polymer liner of the first semiconductor chip is separated from the bonding interface at a position that a top surface of the polymer liner is separated from the bonding interface.