H10W 20/033
In openings in dielectrics
Official title: {in openings in dielectrics}
H10W20/033 (In openings in dielectrics) appears on 8,928 US grants and 9,613 published applications in this corpus.
Search patents in H10W- Granted patents
- 8,928
- Published applications
- 9,613
- Assignees
- 690
- Inventors
- 9,983
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 7 | 0 |
| 1991 | 8 | 0 |
| 1992 | 15 | 0 |
| 1993 | 20 | 0 |
| 1994 | 32 | 0 |
| 1995 | 39 | 0 |
| 1996 | 47 | 0 |
| 1997 | 54 | 0 |
| 1998 | 81 | 0 |
| 1999 | 140 | 0 |
| 2000 | 242 | 0 |
| 2001 | 332 | 132 |
| 2002 | 318 | 340 |
| 2003 | 283 | 285 |
| 2004 | 276 | 340 |
| 2005 | 238 | 371 |
| 2006 | 202 | 369 |
| 2007 | 233 | 369 |
| 2008 | 214 | 364 |
| 2009 | 219 | 341 |
| 2010 | 303 | 272 |
| 2011 | 277 | 218 |
| 2012 | 225 | 238 |
| 2013 | 211 | 203 |
| 2014 | 263 | 300 |
| 2015 | 293 | 440 |
| 2016 | 414 | 416 |
| 2017 | 467 | 425 |
| 2018 | 408 | 446 |
| 2019 | 455 | 485 |
| 2020 | 452 | 538 |
| 2021 | 428 | 473 |
| 2022 | 375 | 560 |
| 2023 | 336 | 549 |
| 2024 | 394 | 503 |
| 2025 | 387 | 419 |
| 2026 | 228 | 217 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for fabricating semiconductor device with protection liner for bit line6 Oct 2026US 12,757,695 B2Nanya Technology Corporation
- Semiconductor device with polymer liner and method for fabricating the same6 Oct 2026US 12,757,707 B2Nanya Technology Corporation
- Semiconductor structure and manufacturing method thereof29 Sep 2026US 12,751,258 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Connecting structure comprising isolation between connecting vias and method for forming the same29 Sep 2026US 12,751,269 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Diffusion barrier for semiconductor device and method29 Sep 2026US 12,751,270 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure including cap layer of two-dimensional material and method for manufacturing the same8 Oct 2026US 2026/0314350 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device including a self-formed barrier metal layer8 Oct 2026US 2026/0314351 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Low resistance interconnect features and method for manufacturing the same8 Oct 2026US 2026/0314352 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Conductive structures and methods of forming the same8 Oct 2026US 2026/0314355 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method thereof8 Oct 2026US 2026/0314356 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Contact structure of semiconductor device1,648US 9,105,490 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Contact structure of semiconductor device1,334US 8,823,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Atomic layer deposition with nitrate containing precursors1,176US 6,203,613 B1International Business Machines Corporation · 2001
- Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers1,159US 5,278,100 AMicron Technology, Inc. · 1994
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015