Method of fabricating interconnect structure for package-on-package devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen, Chiung-Han Yeh, Der-Chyang Yeh
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Abstract
An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.
Claims20
A method of forming a semiconductor device, the method comprising:
- forming a protective layer over a carrier substrate;
- forming through vias extending up from the protective layer;
- attaching one or more dies to the protective layer;
- forming a molding compound between the through vias and the one or more dies;
- electrically coupling electrical connectors to the through vias and electrical contacts on the one or more dies;
- debonding the carrier substrate and exposing the protective layer;
- and
- after the debonding, forming openings in the protective layer to expose the through vias.
A semiconductor device comprising:
- a first package comprising:
- one or more redistribution layers (RDLs);
- an integrated circuit die directly on the one or more RDLs;
- a molding compound adjacent sidewalls of the one or more integrated circuit dies;
- through vias extending through the molding compound;
- and
- a protective layer over the integrated circuit dies;
- and
- a second package mounted over the first package, the second package being electrically coupled to the through vias.
Dependencies are inferred from the claim text.