H10W 20/036
The barrier, adhesion or liner layers being within a main fill metal
Official title: {the barrier, adhesion or liner layers being within a main fill metal}
H10W20/036 (The barrier, adhesion or liner layers being within a main fill metal) appears on 628 US grants and 649 published applications in this corpus.
Search patents in H10W- Granted patents
- 628
- Published applications
- 649
- Assignees
- 112
- Inventors
- 1,142
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 7 | 0 |
| 1999 | 8 | 0 |
| 2000 | 18 | 0 |
| 2001 | 17 | 3 |
| 2002 | 14 | 14 |
| 2003 | 8 | 14 |
| 2004 | 13 | 11 |
| 2005 | 8 | 18 |
| 2006 | 9 | 19 |
| 2007 | 11 | 19 |
| 2008 | 8 | 13 |
| 2009 | 8 | 13 |
| 2010 | 9 | 8 |
| 2011 | 10 | 13 |
| 2012 | 13 | 20 |
| 2013 | 19 | 19 |
| 2014 | 21 | 27 |
| 2015 | 21 | 32 |
| 2016 | 36 | 34 |
| 2017 | 44 | 34 |
| 2018 | 39 | 43 |
| 2019 | 49 | 49 |
| 2020 | 48 | 69 |
| 2021 | 41 | 32 |
| 2022 | 35 | 47 |
| 2023 | 24 | 32 |
| 2024 | 29 | 31 |
| 2025 | 29 | 23 |
| 2026 | 12 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Methods of forming smooth conductive layers for integrated circuit devices276US 6,284,646 B1Samsung Electronics Co., Ltd. · 2001
- Method for filling a dual damascene opening having high aspect ratio to minimize electromigration failure246US 6,245,670 B1Advanced Micro Devices, Inc. · 2001
- Substrate bonding with diffusion barrier structures240US 9,620,481 B2Globalfoundries Inc. · 2017
- Method of enhancing adhesion of a conductive barrier layer to an underlying conductive plug and contact for ferroelectric applications167US 6,576,546 B2Agilent Technologies, Inc. · 2003
- Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity141US 6,069,068 AInternational Business Machines Corporation · 2000