Metal rivet structure and method for fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuen-Ming Liou, Chih-Hao Chen, Wen-Yen Chen
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuen-Ming Liou, Chih-Hao Chen, Wen-Yen Chen
Estimating the term…
A semiconductor structure comprises: a substrate; a dielectric layer above the substrate; a second dielectric layer disposed on the dielectric layer; a metal plug disposed in the dielectric layer and comprising a nonplanar top surface of the metal plug, the nonplanar top surface of the metal plug defining a recess; and a metal rivet structure. The metal rivet structure comprises: a shaft portion penetrating the second dielectric layer and comprising a bottom surface of the shaft portion; and a head portion located in the dielectric layer and comprising a top surface of the head portion and a nonplanar bottom surface of the head portion, wherein the top surface of the head portion is coplanar with the bottom surface of the shaft portion, and the nonplanar bottom surface of the head portion mates with the nonplanar top surface of the metal plug.
A semiconductor structure, comprising:
A metal rivet structure disposed at a back end of a semiconductor chip, the metal rivet structure comprising:
A method comprising:
Dependencies are inferred from the claim text.