Substrate liquid processing method, and recording medium
AssigneeTokyo Electron Limited
InventorsKeiichi Fujita, Takashi Tanaka
Life of this patent
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Abstract
A substrate liquid processing method includes preparing a substrate having a recess on a surface thereof, a seed layer being formed on a surface of the recess; bringing a first pretreatment liquid, containing a reducing agent, a pH adjuster, and an additive configured to accelerate or inhibit an electroless plating reaction, into contact with the seed layer; and precipitating, after the bringing of the first pretreatment liquid into contact with the seed layer, a plating metal in the recess by supplying a first electroless plating liquid to the recess.
Claims4
A substrate liquid processing method, comprising:
- preparing a substrate having a recess on a surface thereof, a seed layer being formed on a surface of the recess;
- bringing a first pretreatment liquid, containing a reducing agent, a pH adjuster, and an additive configured to accelerate or inhibit an electroless plating reaction, into contact with the seed layer;
- and
- precipitating, after the bringing of the first pretreatment liquid into contact with the seed layer, a plating metal in the recess by supplying a first electroless plating liquid to the recess,
- wherein a concentration of the reducing agent in the first pretreatment liquid is higher than a concentration of a reducing agent in the first electroless plating liquid.
A substrate liquid processing method, comprising:
- preparing a substrate having a recess on a surface thereof, a seed layer being formed on a surface of the recess;
- bringing a first pretreatment liquid, containing a reducing agent, a Ph adjuster, and an additive configured to accelerate or inhibit an electroless plating reaction, into contact with the seed layer;
- precipitating, after the bringing of the first pretreatment liquid into contact with the seed layer, a plating metal in the recess by supplying a first electroless plating liquid to the recess;
- and
- precipitating, prior to the bringing of the first pretreatment liquid into contact with the seed layer, a plating metal in the recess by supplying a second electroless plating liquid to the recess.
A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause preparing a substrate having a recess on a surface of which a seed layer is formed, bringing a first pretreatment liquid containing a reducing agent, a pH adjuster, and an additive that accelerates or inhibits an electroless plating reaction into contact with the seed layer, and precipitating, after the bringing of the first pretreatment liquid into contact with the seed layer, a plating metal in the recess by supplying a first electroless plating liquid to the recess to be performed,
- wherein a concentration of the reducing agent in the first pretreatment liquid is higher than a concentration of a reducing agent in the first electroless plating liquid.
Dependencies are inferred from the claim text.