H10W 20/042
The barrier, adhesion or liner layers being seed or nucleation layers
Official title: {the barrier, adhesion or liner layers being seed or nucleation layers}
H10W20/042 (The barrier, adhesion or liner layers being seed or nucleation layers) appears on 2,891 US grants and 3,326 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,891
- Published applications
- 3,326
- Assignees
- 470
- Inventors
- 4,696
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 9 | 0 |
| 1994 | 9 | 0 |
| 1995 | 4 | 0 |
| 1996 | 12 | 0 |
| 1997 | 13 | 0 |
| 1998 | 8 | 0 |
| 1999 | 26 | 0 |
| 2000 | 55 | 0 |
| 2001 | 90 | 45 |
| 2002 | 132 | 129 |
| 2003 | 104 | 110 |
| 2004 | 102 | 119 |
| 2005 | 104 | 165 |
| 2006 | 79 | 142 |
| 2007 | 86 | 139 |
| 2008 | 83 | 145 |
| 2009 | 76 | 144 |
| 2010 | 100 | 114 |
| 2011 | 108 | 88 |
| 2012 | 87 | 107 |
| 2013 | 91 | 69 |
| 2014 | 103 | 109 |
| 2015 | 93 | 167 |
| 2016 | 129 | 136 |
| 2017 | 139 | 134 |
| 2018 | 104 | 134 |
| 2019 | 140 | 156 |
| 2020 | 162 | 196 |
| 2021 | 130 | 157 |
| 2022 | 112 | 153 |
| 2023 | 103 | 145 |
| 2024 | 123 | 146 |
| 2025 | 93 | 98 |
| 2026 | 70 | 79 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Substrate liquid processing method, and recording medium6 Oct 2026US 12,757,697 B2Tokyo Electron Limited
- Technologies for aligned vias29 Sep 2026US 12,751,262 B2Intel Corporation
- Semiconductor substrate, manufacturing method and manufacturing apparatus for semiconductor substrate, semiconductor device, manufacturing method and manufacturing apparatus for semiconductor device, and electronic device15 Sep 2026US 12,740,348 B2KYOCERA Corporation
- Substrate embedded magnetic core inductors and method of making8 Sep 2026US 12,731,717 B2Intel Corporation
- Package structure and method for fabricating the same8 Oct 2026US 2026/0314354 A1National Yang Ming.Chiao Tung University
- Conductive structures and methods of forming the same8 Oct 2026US 2026/0314355 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Conductive vias for redistribution lines in semiconductor devices1 Oct 2026US 2026/0305295 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structures and methods of forming the same1 Oct 2026US 2026/0305303 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Co-integration of Airbridges and 3D Integration Modules24 Sep 2026US 2026/0293678 A1
Most cited
By later US patents
- Method of forming graded thin films using alternating pulses of vapor phase reactants1,034US 6,534,395 B2ASM Microchemistry Oy · 2003
- Production of elemental thin films using a boron-containing reducing agent809US 6,475,276 B1ASM Microchemistry Oy · 2002
- Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)717US 6,428,859 B1Angstron Systems, Inc. · 2002
- Selective electroless copper deposited interconnect plugs for ULSI applications638US 5,674,787 ASematech, Inc. · 1997
- Plated copper interconnect structure621US 5,969,422 AAdvanced Micro Devices, Inc. · 1999