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H10W 20/043

For electroplating

Official title: {for electroplating}

H10W20/043 (For electroplating) appears on 1,352 US grants and 1,557 published applications in this corpus.

Search patents in H10W

Granted patents: 1,352
Published applications: 1,557
Assignees: 294
Inventors: 2,386
Latest grant: 6 Oct 2026

Filings by year

H10W 20/043: granted patents and published applications per publication year
Year	Granted patents	Published applications
1994	2	0
1995	0	0
1996	1	0
1997	3	0
1998	1	0
1999	8	0
2000	22	0
2001	53	26
2002	75	75
2003	65	63
2004	60	69
2005	58	97
2006	46	83
2007	56	81
2008	46	102
2009	48	93
2010	55	73
2011	78	57
2012	52	67
2013	54	29
2014	55	62
2015	40	70
2016	62	60
2017	63	49
2018	49	57
2019	61	51
2020	54	66
2021	46	48
2022	24	39
2023	32	44
2024	33	38
2025	26	26
2026	24	32

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

Recent patents

Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
Conductive structures and methods of forming the same8 Sep 2026US 12,733,465 B2Taiwan Semiconductor Manufacturing Company.Ltd
Methods for etch barrier deposition and devices made according to the same8 Sep 2026US 12,733,467 B2Georgia Tech Research Corporation
Semiconductor device and method28 Jul 2026US 12,696,741 B2Taiwan Semiconductor Manufacturing Company.Ltd
Package structure and method for fabricating the same14 Jul 2026US 12,685,106 B2National Yang Ming.Chiao Tung University

Most cited

By later US patents