H10W 20/0698
Local interconnections
Official title: {Local interconnections}
H10W20/0698 (Local interconnections) appears on 4,630 US grants and 4,729 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,630
- Published applications
- 4,729
- Assignees
- 468
- Inventors
- 6,054
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 8 | 0 |
| 1988 | 5 | 0 |
| 1989 | 13 | 0 |
| 1990 | 14 | 0 |
| 1991 | 12 | 0 |
| 1992 | 14 | 0 |
| 1993 | 19 | 0 |
| 1994 | 26 | 0 |
| 1995 | 26 | 0 |
| 1996 | 30 | 0 |
| 1997 | 35 | 0 |
| 1998 | 43 | 0 |
| 1999 | 101 | 0 |
| 2000 | 139 | 0 |
| 2001 | 157 | 55 |
| 2002 | 140 | 156 |
| 2003 | 127 | 107 |
| 2004 | 105 | 100 |
| 2005 | 79 | 96 |
| 2006 | 80 | 96 |
| 2007 | 65 | 80 |
| 2008 | 58 | 86 |
| 2009 | 52 | 48 |
| 2010 | 59 | 62 |
| 2011 | 63 | 59 |
| 2012 | 59 | 67 |
| 2013 | 59 | 87 |
| 2014 | 91 | 110 |
| 2015 | 136 | 198 |
| 2016 | 226 | 237 |
| 2017 | 288 | 327 |
| 2018 | 273 | 295 |
| 2019 | 302 | 299 |
| 2020 | 290 | 293 |
| 2021 | 228 | 313 |
| 2022 | 245 | 384 |
| 2023 | 233 | 362 |
| 2024 | 298 | 386 |
| 2025 | 273 | 315 |
| 2026 | 146 | 111 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and IC design with non-linear power rails29 Sep 2026US 12,751,260 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Gate contacts for semiconductor devices8 Sep 2026US 12,733,252 B2International Business Machines Corporation
- Shared contact structure and methods for forming the same1 Sep 2026US 12,727,457 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit structure and manufacturing method thereof1 Sep 2026US 12,727,458 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device25 Aug 2026US 12,720,802 B2Samsung Electronics Co., Ltd.
- Semiconductor devices and methods of fabricating the same8 Oct 2026US 2026/0313865 A1Samsung Electronics Co., Ltd.
- Method of manufacturing a semiconductor device1 Oct 2026US 2026/0304879 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Local interconnect1 Oct 2026US 2026/0305283 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit and method for forming the same1 Oct 2026US 2026/0305304 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Self-aligned gate edge and local interconnect24 Sep 2026US 2026/0293234 A1Mediatek Inc.
Most cited
By later US patents
- Contact plugs in SRAM cells and the method of forming the same1,465US 9,236,300 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Method of forming self-aligned contacts and local interconnects549US 8,076,230 B2Macronix International Co., Ltd. · 2011
- Method for simultaneously forming local interconnect with silicided elevated source/drain MOSFET's430US 5,893,741 ANational Science Council · 1999
- Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures421US 10,236,177 B1ASM IP Holding B. V. · 2019