H10W 20/067
By modifying the pattern of conductive parts
Official title: {by modifying the pattern of conductive parts}
H10W20/067 (By modifying the pattern of conductive parts) appears on 756 US grants and 703 published applications in this corpus.
Search patents in H10W- Granted patents
- 756
- Published applications
- 703
- Assignees
- 257
- Inventors
- 1,450
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 8 | 0 |
| 1990 | 8 | 0 |
| 1991 | 6 | 0 |
| 1992 | 9 | 0 |
| 1993 | 11 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 9 | 0 |
| 1997 | 8 | 0 |
| 1998 | 8 | 0 |
| 1999 | 17 | 0 |
| 2000 | 16 | 0 |
| 2001 | 21 | 6 |
| 2002 | 24 | 23 |
| 2003 | 18 | 14 |
| 2004 | 12 | 20 |
| 2005 | 11 | 33 |
| 2006 | 13 | 30 |
| 2007 | 9 | 15 |
| 2008 | 13 | 17 |
| 2009 | 10 | 9 |
| 2010 | 18 | 18 |
| 2011 | 9 | 13 |
| 2012 | 23 | 10 |
| 2013 | 11 | 14 |
| 2014 | 16 | 27 |
| 2015 | 24 | 43 |
| 2016 | 42 | 38 |
| 2017 | 55 | 59 |
| 2018 | 43 | 44 |
| 2019 | 44 | 42 |
| 2020 | 43 | 52 |
| 2021 | 38 | 48 |
| 2022 | 42 | 38 |
| 2023 | 30 | 24 |
| 2024 | 23 | 28 |
| 2025 | 15 | 22 |
| 2026 | 9 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method and IC design with non-linear power rails29 Sep 2026US 12,751,260 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure including lines of different height22 Sep 2026US 12,745,616 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor pattern and method of rounding the same15 Sep 2026US 12,740,397 B2United Microelectronics Corp.
- Semiconductor device and method forming the same9 Jun 2026US 12,653,024 B2Winbond Electronics Corp.
- Low-stress passivation layer5 May 2026US 12,622,262 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Processing solution, method for processing semiconductor substrate, and method for manufacturing semiconductor device1 Oct 2026US 2026/0297465 A1Tokyo Ohka Kogyo.Co., Ltd.
- Integrated circuit devices including a self-aligned via-less contact structure and methods of forming the same24 Sep 2026US 2026/0293642 A1Samsung Electronics Co., Ltd.
- Hard-coding an ic-specific code in an integrated circuit, device24 Sep 2026US 2026/0293663 A1Sandgrain B.V.
- Fabrication method combining laser direct imaging (ldi) and photomask processing17 Sep 2026US 2026/0282859 A1Microchip Technology Incorporated
- Pull-back selective etching processes10 Sep 2026US 2026/0271690 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Method of processing a substrate and a device manufactured by using the method455US 10,134,757 B2ASM IP Holding B. V. · 2018
- Energy-efficient, laser-based method and system for processing target material290US 6,281,471 B1GSI Lumonics Corporation · 2001
- Method of customizing integrated circuits by selective secondary deposition of layer interconnect material255US 5,885,749 AClear Logic, Inc. · 1999
- Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths202US 6,574,250 B2Electro Scientific Industries, Inc. · 2003
- Method of severing electrically conductive links with ultraviolet laser output173US 6,057,180 AElectro Scientific Industries, Inc. · 2000