Fabrication method combining laser direct imaging (ldi) and photomask processing

A method, comprising:

• providing a device layout for a heterogenous integration IC device including multiple IC devices including at least a first IC device including a plurality of first IC device pads and a second IC device including a plurality of second IC device pads, the device layout specifying (a) a target position for the first IC device, including target positions for respective first IC device pads and (b) a target position for the second IC device, including target positions for respective second IC device pads;
• arranging the first IC device and the second IC device on a substrate, wherein the second IC device is misaligned relative to the target position for the second IC device such that respective positions of the second IC device pads are misaligned relative to the target positions for respective second IC device pads;
• performing a laser direct imaging (LDI) process to form (a) substitute second IC device pads on the second IC device at positions corresponding with the target positions for the second IC device pads, and (b) substitute pad connections connecting respective substitute second IC device pads to respective misaligned second IC device pads;
• and
• performing a photomask imaging process to form IC device interconnections to connect respective first IC device pads to respective substitute second IC device pads.

A method, comprising:

• arranging a first IC device on a substrate, the first IC device including first IC device circuitry, a plurality of first IC device pads, and a plurality of first conductive pillars extending upwardly from the plurality of first IC device pads,
• arranging a second IC device on the first IC device in a stacked arrangement, the second IC device including second IC device circuitry, a plurality of second IC device pads, and a plurality of second conductive pillars extending upwardly from the plurality of second IC device pads;
• wherein the second IC device is misaligned relative to a target position for the second IC device, such that respective positions of the second conductive pillars are misaligned relative to target positions for respective second conductive pillars;
• using laser direct imaging (LDI) processing to form (a) substitute pads at positions corresponding with the target positions for the second conductive pillars and (b) second pad connections between the misaligned second conductive pillars and the substitute pads;
• and
• using photomask imaging processing to form IC device interconnections to connect the substitute pads to respective first conductive pillars of the first IC device.