H10W 20/068
By using a laser
Official title: {by using a laser, e.g. laser cutting or laser direct writing}
H10W20/068 (By using a laser) appears on 286 US grants and 250 published applications in this corpus.
Search patents in H10W- Granted patents
- 286
- Published applications
- 250
- Assignees
- 140
- Inventors
- 513
- Latest grant
- 3 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 8 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 6 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 6 | 0 |
| 2000 | 8 | 0 |
| 2001 | 9 | 4 |
| 2002 | 12 | 16 |
| 2003 | 9 | 8 |
| 2004 | 7 | 8 |
| 2005 | 8 | 22 |
| 2006 | 7 | 22 |
| 2007 | 5 | 8 |
| 2008 | 5 | 9 |
| 2009 | 5 | 5 |
| 2010 | 11 | 7 |
| 2011 | 5 | 5 |
| 2012 | 12 | 3 |
| 2013 | 6 | 7 |
| 2014 | 9 | 8 |
| 2015 | 4 | 8 |
| 2016 | 5 | 13 |
| 2017 | 12 | 4 |
| 2018 | 3 | 9 |
| 2019 | 8 | 11 |
| 2020 | 16 | 25 |
| 2021 | 13 | 19 |
| 2022 | 15 | 8 |
| 2023 | 9 | 6 |
| 2024 | 4 | 8 |
| 2025 | 3 | 4 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Trim cut with Qrate adjustment3 Mar 2026US 12,564,902 B2Texas Instruments Incorporated
- Method and device for repairing circuit on array substrate, and array substrate27 Jan 2026US 12,538,772 B2Chuzhou Hkc Optoelectronics Technology Co., Ltd.
- Method of processing wafer18 Nov 2025US 12,476,148 B2Disco Corporation
- Substrate dividing method using an expansion tape and a roller6 May 2025US 12,295,174 B2Disco Corporation
- Manufacturing methods of wafer and chips and position adjustment method of laser beam1 Apr 2025US 12,263,539 B2Disco Corporation
- Fabrication method combining laser direct imaging (ldi) and photomask processing17 Sep 2026US 2026/0282859 A1Microchip Technology Incorporated
- Trim cut with qrate adjustment9 Jul 2026US 2026/0192397 A1
- Method of fabricating package structure19 Feb 2026US 2026/0052961 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Processing system30 Oct 2025US 2025/0336724 A1PlayNitride Display Co., Ltd.
- Semiconductor device and method of manufacturing the same14 Aug 2025US 2025/0259925 A1Renesas Electronics Corporation
Most cited
By later US patents
- Energy-efficient, laser-based method and system for processing target material290US 6,281,471 B1GSI Lumonics Corporation · 2001
- Method of customizing integrated circuits by selective secondary deposition of layer interconnect material255US 5,885,749 AClear Logic, Inc. · 1999
- Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths202US 6,574,250 B2Electro Scientific Industries, Inc. · 2003
- Method of severing electrically conductive links with ultraviolet laser output173US 6,057,180 AElectro Scientific Industries, Inc. · 2000
- Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train163US 6,340,806 B12002