Method and device for repairing circuit on array substrate, and array substrate

A device for repairing a circuit on an array substrate, wherein the array substrate comprises multiple signal lines, and the device comprises:

• a positioning structure for determining a section to be repaired on each signal line;
• a repairing structure for applying a conductive material to form a repair line between two ends of the section to be repaired, the repair line being connected with the two ends of the section to be repaired;
• and
• a protection structure for applying an insulating material to form a cover layer above the repair line, a surface of the repair line being completely covered by the cover layer;
• wherein the repairing structure is further for:
• performing a laser punching operation at the two ends of the section to be repaired, to form a via hole to expose the signal line;
• and
• applying the conductive material to form the repair line based on the via hole;
• wherein the two ends of the section comprise a first endpoint and a second endpoint;
• the repairing structure is further for:
• determining a first endpoint at one end of the section to be repaired, and performing the laser punching operation at the first endpoint;
• determining an included angle between the signal line and a side of the array substrate;
• and
• determining a second endpoint at the other end of the section to be repaired based at least on the included angle and the first endpoint, and performing the laser punching operation at the second endpoint.

An array substrate manufactured by a method for repairing a circuit on an array substrate, the array substrate comprising multiple signal lines, wherein the method comprises:

• determining a section to be repaired on each signal line;
• applying a conductive material to form a repair line between two ends of the section to be repaired, the repair line being connected with the two ends of the section to be repaired;
• and
• applying an insulating material to form a cover layer above the repair line, a surface of the repair line being completely covered by the cover layer;
• wherein the operation of applying the conductive material to form the repair line between two ends of the section to be repaired comprises:
• performing a laser punching operation at the two ends of the section to be repaired, to form a via hole to expose the signal line;
• and
• applying the conductive material to form the repair line based on the via hole;
• wherein the two ends of the section comprise a first endpoint and a second endpoint;
• the operation of performing the laser punching operation at the two ends of the section to be repaired comprises:
• determining a first endpoint at one end of the section to be repaired, and performing the laser punching operation at the first endpoint;
• determining an included angle between the signal line and a side of the array substrate;
• and
• determining a second endpoint at the other end of the section to be repaired based at least on the included angle and the first endpoint, and performing the laser punching operation at the second endpoint.