Method of fabricating package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Tsu Chung, Yung-Chi Lin
Life of this patent
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Abstract
Provided is a method of fabricating a package structure including: forming a first bonding layer over a first surface of a first die; forming a release structure over a first carrier; bonding the first die to the first carrier by contacting the first bonding layer with the release structure; performing a laser process to divide the release structure into a first portion and a second portion, thereby debonding the first carrier from the first die; and performing a first removal process on the first portion of the release structure over the first carrier to expose a surface of the first carrier. The cleaned first carrier can be reused to fabricate another package structure, thereby reducing manufacturing costs and be greener or more environmentally friendly.
Claims20
A method of fabricating a package structure, comprising:
- forming a first bonding layer over a first surface of a first die;
- forming a release structure over a first carrier;
- bonding the first die to the first carrier by contacting the first bonding layer with the release structure;
- performing a laser process to divide the release structure into a first portion and a second portion, thereby debonding the first carrier from the first die;
- and
- performing a first removal process on the first portion of the release structure over the first carrier to expose a surface of the first carrier.
A method of fabricating a package structure, comprising:
- forming a release layer over a first carrier;
- bonding the first carrier to a frontside of a first die, so that the release layer is sandwiched between the first carrier and the frontside of the first die;
- performing a laser process to divide the release layer into a first portion and a second portion, thereby debonding the first carrier from the first die;
- and
- performing a second removal process on the second portion of the release layer over the frontside of the first die.
A method of fabricating a package structure, comprising:
- bonding a first carrier to a package wherein a laser decomposition layer is vertically disposed between the first carrier and the package;
- decomposing the laser decomposition layer to debond the first carrier from the package;
- performing a first removal process on the first carrier;
- and
- reusing the first carrier to fabricate another package structure.
Dependencies are inferred from the claim text.