Method of severing electrically conductive links with ultraviolet laser output

A method of severing a first electrically conductive link fabricated on a semiconductor substrate, the first link being separated from a second electrically conductive link by an inorganic dielectric passivation material positioned between them and having wavelength-sensitive light absorption characteristics, comprising:

• generating and directing at a predetermined wavelength toward the first link ultraviolet laser output having energy characterized by a power density of sufficient magnitude over a spot area having a diameter of less than about 2.0 .mu.m to sever the link and in cooperation with the predetermined wavelength interacting with the passivation material, such that the wavelength-sensitive light absorption characteristics of the passivation material cause it to attenuate energy of the laser output reflected from the first link toward the second link to prevent the laser output from damaging the second link.

A method of severing an electrically conductive link between a pair of electrically conductive contact pads fabricated on a semiconductor substrate in an integrated circuit link structure that includes an inorganic dielectric passivation layer positioned between the link and the substrate, the passivation layer having a height and wavelength-sensitive light absorption characteristics, comprising:

• generating and directing toward the link structure ultraviolet laser output having energy characterized by a power density of sufficient magnitude over a spot area of a diameter of less than about 2.0 .mu.m and a predetermined wavelength interacting with the wavelength-sensitive light absorption characteristics of the passivation layer to sever the link, the height and wavelength-sensitive light absorption characteristics of the passivation layer cooperating to prevent the laser output from damaging the substrate underlying the link.