H10W 20/40
Interconnections external to wafers or substrates
Official title: Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
H10W20/40 (Interconnections external to wafers or substrates) appears on 43,203 US grants and 47,645 published applications in this corpus.
Search patents in H10W- Granted patents
- 43,203
- Published applications
- 47,645
- Assignees
- 2,972
- Inventors
- 44,492
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 65 | 0 |
| 1977 | 43 | 0 |
| 1978 | 49 | 0 |
| 1979 | 37 | 0 |
| 1980 | 51 | 0 |
| 1981 | 53 | 0 |
| 1982 | 49 | 0 |
| 1983 | 51 | 0 |
| 1984 | 65 | 0 |
| 1985 | 91 | 0 |
| 1986 | 73 | 0 |
| 1987 | 104 | 0 |
| 1988 | 92 | 0 |
| 1989 | 128 | 0 |
| 1990 | 171 | 0 |
| 1991 | 197 | 0 |
| 1992 | 216 | 0 |
| 1993 | 198 | 0 |
| 1994 | 246 | 0 |
| 1995 | 243 | 0 |
| 1996 | 285 | 0 |
| 1997 | 339 | 0 |
| 1998 | 419 | 0 |
| 1999 | 524 | 0 |
| 2000 | 645 | 0 |
| 2001 | 738 | 352 |
| 2002 | 907 | 959 |
| 2003 | 856 | 922 |
| 2004 | 838 | 993 |
| 2005 | 749 | 1162 |
| 2006 | 767 | 1082 |
| 2007 | 709 | 1086 |
| 2008 | 679 | 1235 |
| 2009 | 692 | 1139 |
| 2010 | 991 | 1121 |
| 2011 | 1015 | 1007 |
| 2012 | 942 | 1182 |
| 2013 | 1147 | 1233 |
| 2014 | 1371 | 1690 |
| 2015 | 1590 | 2021 |
| 2016 | 2080 | 2153 |
| 2017 | 2393 | 2411 |
| 2018 | 2271 | 2320 |
| 2019 | 2353 | 2566 |
| 2020 | 2508 | 2959 |
| 2021 | 2325 | 2965 |
| 2022 | 2177 | 3114 |
| 2023 | 2248 | 3227 |
| 2024 | 2392 | 3476 |
| 2025 | 2499 | 3345 |
| 2026 | 1532 | 1925 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 20/41Characterised by their conductive parts27,395
- H10W 20/45Characterised by their insulating parts8,448
- H10W 20/495Capacitive arrangements or effects of, or between wiring layers5,304
- H10W 20/49Adaptable interconnections4,854
- H10W 20/497Inductive arrangements or effects of, or between, wiring layers2,495
- H10W 20/482For individual devices provided for in groups h10d8/00 - h10d48/001,209
- H10W 20/481On the rear surfaces of the wafers or substrates1,120
- H10W 20/498Resistive arrangements or effects of, or between, wiring layers991
Recent patents
- Composition and method for treating substrate6 Oct 2026US 12,753,342 B2FUJIFILM Corporation
- Semiconductor device layout6 Oct 2026US 12,755,079 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Half-bridge circuit using monolithic flip-chip GAN power devices6 Oct 2026US 12,756,203 B2Navitas Semiconductor Limited
- Vertical transistors with backside power delivery6 Oct 2026US 12,757,371 B2Apple Inc.
- Memory cell with reduced parasitic capacitance and conductive via extending into source/drain region6 Oct 2026US 12,757,383 B2Nanya Technology Corporation
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Memory device8 Oct 2026US 2026/0311751 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Ternary content-addressable memory cells and methods for forming the same8 Oct 2026US 2026/0311760 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices and methods of fabricating the same8 Oct 2026US 2026/0313865 A1Samsung Electronics Co., Ltd.
- Memory device with alternating metal lines8 Oct 2026US 2026/0313866 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Contact structure of semiconductor device1,648US 9,105,490 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Contact structure of semiconductor device1,334US 8,823,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Package with metal-insulator-metal capacitor and method of manufacturing the same1,021US 9,263,511 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016