H10W 20/495
Capacitive arrangements or effects of, or between wiring layers
Official title: {Capacitive arrangements or effects of, or between wiring layers}
H10W20/495 (Capacitive arrangements or effects of, or between wiring layers) appears on 5,304 US grants and 5,973 published applications in this corpus.
Search patents in H10W- Granted patents
- 5,304
- Published applications
- 5,973
- Assignees
- 715
- Inventors
- 8,013
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 7 | 0 |
| 1991 | 14 | 0 |
| 1992 | 16 | 0 |
| 1993 | 13 | 0 |
| 1994 | 13 | 0 |
| 1995 | 20 | 0 |
| 1996 | 29 | 0 |
| 1997 | 29 | 0 |
| 1998 | 60 | 0 |
| 1999 | 69 | 0 |
| 2000 | 85 | 0 |
| 2001 | 94 | 46 |
| 2002 | 136 | 163 |
| 2003 | 151 | 149 |
| 2004 | 144 | 184 |
| 2005 | 152 | 246 |
| 2006 | 157 | 223 |
| 2007 | 146 | 249 |
| 2008 | 152 | 241 |
| 2009 | 140 | 167 |
| 2010 | 166 | 182 |
| 2011 | 165 | 143 |
| 2012 | 157 | 157 |
| 2013 | 172 | 166 |
| 2014 | 173 | 204 |
| 2015 | 198 | 241 |
| 2016 | 291 | 252 |
| 2017 | 261 | 241 |
| 2018 | 227 | 237 |
| 2019 | 234 | 230 |
| 2020 | 233 | 309 |
| 2021 | 227 | 310 |
| 2022 | 250 | 339 |
| 2023 | 259 | 340 |
| 2024 | 237 | 335 |
| 2025 | 256 | 383 |
| 2026 | 140 | 236 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Single backside power plane for improved power delivery6 Oct 2026US 12,757,716 B2International Business Machines Corporation
- Semiconductor device with MIM capacitor and method for manufacturing same29 Sep 2026US 12,751,022 B2Hangzhou Fullsemi Semiconductor Co., Ltd.
- Technologies for aligned vias29 Sep 2026US 12,751,262 B2Intel Corporation
- Metal-insulator-metal structures and methods of forming the same29 Sep 2026US 12,751,283 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor component with metal-insulator-metal capacitor assembly22 Sep 2026US 12,745,627 B2Imec Vzw
- Capacitor cell regions, semiconductor device including same and methods of manufacturing same8 Oct 2026US 2026/0314389 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Structures And Methods Of Forming The Same8 Oct 2026US 2026/0314390 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Embedding a metal-insulator-metal capacitor in a passivation layer8 Oct 2026US 2026/0314391 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Extended via connect for pixel array8 Oct 2026US 2026/0314392 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Capacitor integrated passive device with common grounded through-substrate-via and substrate backside conductor and methods of forming the same8 Oct 2026US 2026/0314447 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Package with metal-insulator-metal capacitor and method of manufacturing the same1,021US 9,263,511 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Porous dielectric material with improved pore surface properties for electronics applications635US 5,504,042 ATexas Instruments Incorporated · 1996
- Porous dielectric material with improved pore surface properties for electronics applications623US 6,140,252 ATexas Instruments Incorporated · 2000
- Package with passive devices and method of forming the same576US 8,809,996 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Structures and methods for integration of ultralow-k dielectrics with improved reliability554US 7,088,003 B2International Business Machines Corporation · 2006