H10W 20/496
Capacitor integral with wiring layers
Official title: {Capacitor integral with wiring layers}
H10W20/496 (Capacitor integral with wiring layers) appears on 3,087 US grants and 3,892 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,087
- Published applications
- 3,892
- Assignees
- 550
- Inventors
- 5,332
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 14 | 0 |
| 2000 | 21 | 0 |
| 2001 | 23 | 11 |
| 2002 | 44 | 51 |
| 2003 | 47 | 65 |
| 2004 | 59 | 89 |
| 2005 | 78 | 128 |
| 2006 | 70 | 130 |
| 2007 | 84 | 193 |
| 2008 | 105 | 166 |
| 2009 | 85 | 107 |
| 2010 | 99 | 132 |
| 2011 | 108 | 98 |
| 2012 | 124 | 124 |
| 2013 | 130 | 122 |
| 2014 | 125 | 144 |
| 2015 | 139 | 154 |
| 2016 | 191 | 146 |
| 2017 | 159 | 157 |
| 2018 | 146 | 155 |
| 2019 | 158 | 154 |
| 2020 | 161 | 217 |
| 2021 | 147 | 207 |
| 2022 | 160 | 207 |
| 2023 | 164 | 229 |
| 2024 | 160 | 241 |
| 2025 | 164 | 284 |
| 2026 | 100 | 181 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device with MIM capacitor and method for manufacturing same29 Sep 2026US 12,751,022 B2Hangzhou Fullsemi Semiconductor Co., Ltd.
- Technologies for aligned vias29 Sep 2026US 12,751,262 B2Intel Corporation
- Metal-insulator-metal structures and methods of forming the same29 Sep 2026US 12,751,283 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Embedding a metal-insulator-metal capacitor in a passivation layer22 Sep 2026US 12,745,628 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Capacitor cell regions, semiconductor device including same and methods of manufacturing same8 Oct 2026US 2026/0314389 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Structures And Methods Of Forming The Same8 Oct 2026US 2026/0314390 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Embedding a metal-insulator-metal capacitor in a passivation layer8 Oct 2026US 2026/0314391 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Extended via connect for pixel array8 Oct 2026US 2026/0314392 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Capacitor integrated passive device with common grounded through-substrate-via and substrate backside conductor and methods of forming the same8 Oct 2026US 2026/0314447 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Package with metal-insulator-metal capacitor and method of manufacturing the same1,021US 9,263,511 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Package with passive devices and method of forming the same576US 8,809,996 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias532US 5,414,221 AIntel Corporation · 1995
- Metal capacitor and method of making the same470US 8,114,734 B2United Microelectronics Corp. · 2012
- Capacitor structure for an integrated circuit396US 5,583,359 ANorthern Telecom Limited · 1996