Back to results
US 8,809,996 B2Granted
Package with passive devices and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShuo-Mao Chen, Der-Chyang Yeh, Li-Hsien Huang
Life of this patent
Estimating the term…
Abstract
An embodiment is a device comprising a substrate, a metal pad over the substrate, and a passivation layer comprising a portion over the metal pad. The device further comprises a metal pillar over and electrically coupled to the metal pad, and a passive device comprising a first portion at a same level as the metal pillar, wherein the first portion of the passive device is formed of a same material as the metal pillar.
Claims19
A device comprising:
- a substrate;
- a metal pad over the substrate;
- a first passivation layer having a substantially uniform thickness and comprising a portion over the metal pad;
- a second passivation layer over the first passivation layer and comprising a portion over the metal pad;
- a metal pillar over and electrically coupled to the metal pad, wherein the metal pillar extends through the first and second passivation layers;
- and
- a passive device comprising a first portion over the first passivation layer and in the second passivation layer, wherein the first portion of the passive device is formed of a same material as the metal pillar, wherein top surfaces of the metal pillar, the first portion of the passive device, and the second passivation layer are substantially level with each other.
4 more elements
A device comprising:
- a die comprising:
- a semiconductor substrate;
- a metal pad over the semiconductor substrate;
- a passivation layer comprising a portion over the metal pad;
- and
- a metal pillar over the metal pad and extending into the passivation layer;
- a molding compound encircling the die;
- a dielectric layer over the metal pillar, the passivation layer, and the molding compound;
- a post-passivation interconnect (PPI) line over the dielectric layer and electrically coupled to the metal pad through the metal pillar and a via in the dielectric layer;
- and
- a passive device comprising a first portion in the passivation layer, and a second portion over the dielectric layer.
8 more elements
A device comprising:
- a substrate;
- a conductive pad over the substrate;
- a passivation layer comprising a portion over the conductive pad;
- a conductive pillar over and electrically coupled to the conductive pad;
- a molding compound surrounding the substrate, the molding compound extending from a first surface that is substantially coplanar with a bottom of the substrate to a second surface that is above the conductive pad;
- and
- a passive device comprising a first portion at a same level as the conductive pillar, and a second portion overlapping the molding compound, the second surface of the molding compound being substantially planar and substantially coplanar with top surfaces of the conductive pillar and the first portion of the passive device.
4 more elements
Dependencies are inferred from the claim text.