H10W 20/49
Adaptable interconnections
Official title: Adaptable interconnections, e.g. fuses or antifuses
H10W20/49 (Adaptable interconnections) appears on 4,854 US grants and 4,598 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,854
- Published applications
- 4,598
- Assignees
- 727
- Inventors
- 6,173
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 5 | 0 |
| 1978 | 4 | 0 |
| 1979 | 7 | 0 |
| 1980 | 10 | 0 |
| 1981 | 6 | 0 |
| 1982 | 4 | 0 |
| 1983 | 8 | 0 |
| 1984 | 16 | 0 |
| 1985 | 16 | 0 |
| 1986 | 11 | 0 |
| 1987 | 23 | 0 |
| 1988 | 14 | 0 |
| 1989 | 24 | 0 |
| 1990 | 23 | 0 |
| 1991 | 22 | 0 |
| 1992 | 29 | 0 |
| 1993 | 37 | 0 |
| 1994 | 52 | 0 |
| 1995 | 47 | 0 |
| 1996 | 67 | 0 |
| 1997 | 58 | 0 |
| 1998 | 76 | 0 |
| 1999 | 91 | 0 |
| 2000 | 96 | 0 |
| 2001 | 130 | 45 |
| 2002 | 142 | 141 |
| 2003 | 167 | 178 |
| 2004 | 150 | 169 |
| 2005 | 120 | 190 |
| 2006 | 107 | 197 |
| 2007 | 107 | 272 |
| 2008 | 132 | 247 |
| 2009 | 134 | 230 |
| 2010 | 212 | 199 |
| 2011 | 183 | 189 |
| 2012 | 183 | 198 |
| 2013 | 222 | 176 |
| 2014 | 199 | 227 |
| 2015 | 229 | 232 |
| 2016 | 212 | 196 |
| 2017 | 227 | 212 |
| 2018 | 188 | 177 |
| 2019 | 190 | 176 |
| 2020 | 174 | 160 |
| 2021 | 140 | 158 |
| 2022 | 123 | 169 |
| 2023 | 137 | 171 |
| 2024 | 123 | 124 |
| 2025 | 123 | 114 |
| 2026 | 52 | 51 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device structure including fuse structure embedded in substrate6 Oct 2026US 12,757,389 B2Nanya Technology Corporation
- Die-to-die power delivery22 Sep 2026US 12,745,622 B2Altera Corporation
- Semiconductor device having fuse component22 Sep 2026US 12,745,626 B2Nanya Technology Corporation
- Semiconductor storage device, printing apparatus, and write control method of semiconductor storage device15 Sep 2026US 12,740,403 B2Canon Kabushiki Kaisha
- Microelectronic mechanical fuse and anti-fuse apparatus and method15 Sep 2026US 12,740,404 B2Rockwell Collins, Inc.
- Memory devices and methods of manufacturing thereof1 Oct 2026US 2026/0304864 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electrostatic discharge (esd) circuits using front end (fe) diodes and metal-in-metal (mim) via fuses in interconnect layers1 Oct 2026US 2026/0305316 A1Intel Corporation
- Hard-coding an ic-specific code in an integrated circuit, device24 Sep 2026US 2026/0293663 A1Sandgrain B.V.
- Mim memory cell with backside interconnect structures17 Sep 2026US 2026/0282346 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Sandwich structure for via and interconnect17 Sep 2026US 2026/0282891 A1International Business Machines Corporation
Most cited
By later US patents
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Package with metal-insulator-metal capacitor and method of manufacturing the same1,021US 9,263,511 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Package with passive devices and method of forming the same576US 8,809,996 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof505US 6,962,867 B2MicronTechnology, Inc. · 2005
- Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies495US 6,800,930 B2Micron Technology, Inc. · 2004